Patents by Inventor AAC Microtec AB

AAC Microtec AB has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LOW RESISTANCE THROUGH-WAFER VIA
    Publication number: 20130164935
    Abstract: The present invention provides a wafer (3) comprising a through-wafer via (7) through the wafer (3) formed by a through-wafer via hole (9) and at least a first conductive coating (25). A substantially vertical sidewall (11) of the through-wafer via hole (9) except for a constriction (23) provides a reliable through-wafer via (7) occupying a small area on the wafer. The wafer (3) is preferably made of a semiconductor material, such as silicon, or a glass ceramic. A method for manufacturing such a wafer (3) is described.
    Type: Application
    Filed: December 3, 2012
    Publication date: June 27, 2013
    Applicant: AAC Microtec AB
    Inventor: AAC Microtec AB