Patents by Inventor Aarne Oja
Aarne Oja has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230412140Abstract: A MEMS (microelectromechanical system) resonator with a material layer of single-crystalline silicon, at least one layer made of material with low thermal diffusivity to reduce thermoelastic dissipations in the MEMS resonator, a layer of piezoelectric material, and a layer made of electrically conducting material. The said-layer with low thermal diffusivity is between the single-crystalline silicon layer and the piezoelectric layer, or between the piezoelectric layer and the electrically conducting layer. The use of a material layer of low thermal diffusivity.Type: ApplicationFiled: September 23, 2021Publication date: December 21, 2023Applicant: Kyocera Tikitin OyInventors: Aarne OJA, Antti Jaakkola, Panu KOPPINEN
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Publication number: 20230231538Abstract: A MEMS (microelectromechanical system) resonator includes a first layer of single-crystalline silicon, a second layer of single-crystalline silicon, and a piezoelectric layer in between said first layer of single-crystalline silicon and the second layer of single-crystalline silicon. A manufacturing method of the MEMS resonator includes at least one of the interfaces between the single-crystalline silicon layers and the piezoelectric layer be made by wafer bonding.Type: ApplicationFiled: July 1, 2021Publication date: July 20, 2023Applicant: KYOCERA Tikitin OyInventor: Aarne OJA
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Patent number: 11697586Abstract: The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.Type: GrantFiled: September 22, 2020Date of Patent: July 11, 2023Assignee: Teknologian tutkimuskeskus VTT OyInventors: Aarne Oja, Jaakko Saarilahti
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Publication number: 20230133733Abstract: A silicon microelectromechanical system, MEMS, resonator assembly, includes four flexural beam elements forming a rectangular frame, each beam element being connected at an end thereof to an end of a neighboring one of the beam elements. The resonator assembly further includes connection elements for connecting the rectangular frame to at least one mechanical anchor, and the resonator assembly supporting an in-plane flexural collective resonance mode.Type: ApplicationFiled: March 30, 2021Publication date: May 4, 2023Applicant: KYOCERA Tikitin OyInventors: Ville SAARELA, Antti JAAKKOLA, Aarne OJA
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Publication number: 20220166406Abstract: A microelectromechanical (MEMS) resonator includes a spring-mass system having a first weight portion (M1), a second weight portion (M2), and a central spring portion (SP) in between the weight portions.Type: ApplicationFiled: April 15, 2020Publication date: May 26, 2022Applicant: KYOCERA Tikitin OyInventors: Ville SAARELA, Antti JAAKKOLA, Aarne OJA
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Patent number: 11190133Abstract: A temperature-compensated microelectromechanical oscillator and a method of fabricating thereof. The oscillator includes a resonator element including highly doped silicon and an actuator for exciting the resonator body into a resonance mode having a characteristic frequency-vs-temperature curve. The properties of the resonator element and the actuator are chosen such that the curve has a high-temperature turnover point at a turnover temperature of 85° C. or more. In addition, the oscillator comprises a thermostatic controller for keeping the temperature of the resonator element at said high turnover temperature.Type: GrantFiled: September 5, 2018Date of Patent: November 30, 2021Assignee: KYOCERA Tikitin OyInventors: Aarne Oja, Antti Jaakkola
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Publication number: 20210135626Abstract: A temperature-compensated microelectromechanical oscillator and a method of fabricating thereof. The oscillator includes a resonator element including highly doped silicon and an actuator for exciting the resonator body into a resonance mode having a characteristic frequency-vs-temperature curve. The properties of the resonator element and the actuator are chosen such that the curve has a high-temperature turnover point at a turnover temperature of 85° C. or more. In addition, the oscillator comprises a thermostatic controller for keeping the temperature of the resonator element at said high turnover temperature.Type: ApplicationFiled: September 5, 2018Publication date: May 6, 2021Applicant: KYOCERA Tikitin OyInventors: Aarne OJA, Antti Jaakkola
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Patent number: 10965267Abstract: The present disclosure describes micromechanical resonator, a resonator element for the resonator, and a method for trimming the resonator. The resonator comprises a resonator element having a length, a width, and a thickness, where the length and the width define a plane of the resonator element. The resonator element comprises at least two regions (52, 53) in the plane of the resonator element, wherein the at least two regions have different thicknesses.Type: GrantFiled: June 29, 2017Date of Patent: March 30, 2021Assignee: TEKNOLOGIAN TUTKIMUSKESKUS VTT OYInventors: Antti Jaakkola, Tuomas Pensala, Aarne Oja, Panu Pekko, James R Dekker
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Publication number: 20210036686Abstract: A microelectromechanical resonator, including a support structure, a resonator element suspended to the support structure, the resonator element including a plurality of sub-elements, and an actuator for exciting the resonator element into a resonance mode. The sub-elements are dimensioned such that they are dividable in one direction into one or more fundamental elements having an aspect ratio different from 1 so that each of the fundamental elements supports a fundamental resonance mode, which together define a compound resonance mode of the sub-element. The sub-elements are further coupled to each other by connection elements and positioned with respect to each other such that the fundamental elements are in a rectangular array configuration, wherein each fundamental element occupies a single array position, and at least one array position of the array configuration is free from fundamental elements.Type: ApplicationFiled: February 6, 2019Publication date: February 4, 2021Applicant: KYOCERA Tikitin OyInventors: Antti JAAKKOLA, Aarne OJA
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Patent number: 10911050Abstract: A frequency reference oscillator device and method of providing a frequency reference signal. The oscillator device includes a first oscillator including a first resonator having first long-term stability and a first frequency-vs-temperature turnover temperature, the first oscillator being capable of providing a first frequency signal. Further, the device includes and a second oscillator including a second resonator having second long-term stability, which is inferior to the first long-term stability, and a second frequency-vs-temperature turnover temperature, the second oscillator being capable of providing a second frequency signal.Type: GrantFiled: September 5, 2018Date of Patent: February 2, 2021Assignee: KYOCERA Tikitin OyInventors: Aarne Oja, Antti Jaakkola
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Publication number: 20210002127Abstract: The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.Type: ApplicationFiled: September 22, 2020Publication date: January 7, 2021Inventors: Aarne Oja, Jaakko Saarilahti
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Patent number: 10807861Abstract: The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.Type: GrantFiled: May 2, 2017Date of Patent: October 20, 2020Assignee: Teknologian tutkimuskeskus VTT OyInventors: Aarne Oja, Jaakko Saarilahti
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Publication number: 20200220549Abstract: A frequency reference oscillator device and method of providing a frequency reference signal. The oscillator device includes a first oscillator including a first resonator having first long-term stability and a first frequency-vs-temperature turnover temperature, the first oscillator being capable of providing a first frequency signal. Further, the device includes and a second oscillator including a second resonator having second long-term stability, which is inferior to the first long-term stability, and a second frequency-vs-temperature turnover temperature, the second oscillator being capable of providing a second frequency signal.Type: ApplicationFiled: September 5, 2018Publication date: July 9, 2020Applicant: KYOCERA Tikitin OyInventors: Aarne OJA, Antti Jaakkola
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Publication number: 20190173451Abstract: The present disclosure describes micromechanical resonator, a resonator element for the resonator, and a method for trimming the resonator. The resonator comprises a resonator element having a length, a width, and a thickness, where the length and the width define a plane of the resonator element. The resonator element comprises at least two regions (52, 53) in the plane of the resonator element, wherein the at least two regions have different thicknesses.Type: ApplicationFiled: June 29, 2017Publication date: June 6, 2019Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTT OYInventors: Antti JAAKKOLA, Tuomas PENSALA, Aarne OJA, Panu PEKKO, James R DEKKER
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Publication number: 20190119102Abstract: The present publication discloses a micromechanical structure including at least one active element, the micromechanical structure comprising a substrate, at least one layer formed on the substrate forming the at least part of the at least one active element, mechanical contact areas through which the micromechanical structure can be connected to other structures like printed circuit boards and like. In accordance with the invention the micromechanical structure includes weakenings like trenches around the mechanical contact areas for eliminating the thermal mismatch between the active element of the micromechanical structure and the other structures.Type: ApplicationFiled: May 2, 2017Publication date: April 25, 2019Inventors: Aarne Oja, Jaakko Saarilahti
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Publication number: 20190112181Abstract: The invention provides a micromechanical device comprising a support structure and a deflecting element connected to the support structure, wherein the deflecting element comprises at least one deformable member adapted to deform extensionally, flexurally or torsionally with respect to a deformation axis for allowing deflection of the deflecting element with respect to the support structure. Further, there are means for statically deflecting the deflecting element or detecting the magnitude of static deflection of the deflecting element. According to the invention, the deformable member is made of silicon doped with an n-type doping agent to a doping concentration of at least 1.1*1020 cm?3. The invention allows for manufacturing micromechanical devices whose mechanical operation is not affected by prevailing temperature conditions.Type: ApplicationFiled: March 31, 2017Publication date: April 18, 2019Inventors: Antti JAAKKOLA, Tuomas PENSALA, Mika PRUNNILA, Panu PEKKO, Jyrki KIIHAMÄKI, Aarne OJA
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Publication number: 20120229226Abstract: The invention relates to a micromechanical resonator comprising a substrate (1) of first material (2), a resonator (3) suspended to the supporting structure (1), the resonator (3) being at least partially of the same material (2) as the supporting structure and dimensioned for resonation at a specific frequency f0, coupling means (5) for initiating, maintaining and coupling the resonation of the resonator (3) to an external circuit (6), and the resonator (3) including second material (4), the thermal properties of which being different from the first material (2). In accordance with the invention the resonator (3) includes the second material (4) located concentrated in specific places of the resonator (3).Type: ApplicationFiled: September 27, 2010Publication date: September 13, 2012Applicant: TEKNOLOGIAN TUTKIMUSKESKUS VTTInventors: Aarne Oja, Tuomas Pensala, Johanna Meltaus
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Patent number: 8136403Abstract: The present invention relates to a micromechanical sensor for analyzing liquid samples and an array of such sensors. The invention also concerns a method for sensing liquid samples and the use of longitudinal bulk acoustic waves for analyzing liquid phase samples micromechanically. The sensor comprises a body and a planar wave guide portion spaced from the body. At least one electro-mechanical transducer element are used for excitation of longitudinal bulk acoustic waves to the wave guide portion in response to electrical actuation and for converting acoustic waves into electrical signals. The wave guide portion is provided with a sample-receiving zone onto which the sample can be introduced. By means of the invention, the sensitivity of micromechanical liquid sensors can be improved.Type: GrantFiled: July 4, 2006Date of Patent: March 20, 2012Assignee: Valtion Teknillinen TutkimuskeskusInventors: Heikki Seppa, Kirsi Tappura, Jussi Tuppurainen, Tomi Mattila, Ari Alastalo, Hannu Helle, Aarne Oja
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Publication number: 20120046571Abstract: The present publication discloses a method for detecting ethanol, in which method the ethanol content of a person is measured. According to the invention, the ethanol content is measured from the person's skin, using a capacitive measurement method.Type: ApplicationFiled: February 23, 2010Publication date: February 23, 2012Applicant: Teknologian tutkimuskeskus VTTInventors: Timo Varpula, Aarne Oja, Heikki Seppa, Mika Suhonen
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Publication number: 20090277271Abstract: The present invention relates to a micromechanical sensor for analyzing liquid samples and an array of such sensors. The invention also concerns a method for sensing liquid samples and the use of longitudinal bulk acoustic waves for analyzing liquid phase samples micromechanically. The sensor comprises a body and a planar wave guide portion spaced from the body. At least one electro-mechanical transducer element are used for excitation of longitudinal bulk acoustic waves to the wave guide portion in response to electrical actuation and for converting acoustic waves into electrical signals. The wave guide portion is provided with a sample-receiving zone onto which the sample can be introduced. By means of the invention, the sensitivity of micromechanical liquid sensors can be improved.Type: ApplicationFiled: July 4, 2006Publication date: November 12, 2009Applicant: VALTION TEKNILLINEN TUTKIMUSKESKUSInventors: Heikki Seppa, Kirsi Tappura, Jussi Tuppurainen, Tomi Mattila, Ari Alastalo, Hannu Helle, Aarne Oja