Patents by Inventor Aaron B. Mullins

Aaron B. Mullins has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5166865
    Abstract: A circuit carrying substrate (108) accommodates circuit components (102) with different coefficients of expansion and contraction from that of the circuit carrying substrate (108). Beneath the components (102) a plurality of slots (104) are formed so as to minimize the effects of the differing coefficients of expansion and contraction.
    Type: Grant
    Filed: September 30, 1991
    Date of Patent: November 24, 1992
    Assignee: Motorola, Inc.
    Inventors: Andrew T. Morrison, Aaron B. Mullins
  • Patent number: 4838475
    Abstract: An EMI/RFI shield (10) comprises a box like structure formed of a metal integral member having a plurality of apertures (16) formed therethrough. The apertures (16) are of a size appropriate to substantially pass infrared energy (22) and to substantially block EMI/RFI energy (26). When placed on a substrate (18), infrared energy (22) can be utilized to reflow solder a device (19) encapsulated by the shield (10) to the substrate (18).
    Type: Grant
    Filed: August 28, 1987
    Date of Patent: June 13, 1989
    Assignee: Motorola, Inc.
    Inventors: Aaron B. Mullins, Michael H. Bartlett
  • Patent number: 4736069
    Abstract: Disclosed is an improved housing being comprised of a substrate and a cover that is plated to provide RF shielding. The substrate and cover are constructed of a like material to keep the coefficients of vibration approximately identical. Preferably, the substrate and cover material are ceramic thereby providing a rigid structure that minimizes vibration degradation.
    Type: Grant
    Filed: September 30, 1986
    Date of Patent: April 5, 1988
    Assignee: Motorola, Inc.
    Inventor: Aaron B. Mullins