Abstract: A positive electrode active material includes a compound represented by formula 1: Li 1.1 ? Mn 0.52 ? Ni 0 . 3 ? 8 - x ? M x ? O 2 ( 1 ) wherein: M is Co or Cr; 2<average oxidation state of Ni ion<2.15; and 0<x<0.06.

Abstract: Exemplary embodiments provide a semiconductor package and methods for its formation. The disclosed semiconductor package can use conductive plug(s) to replace solder ball(s) of a conventional BGA semiconductor package. In one embodiment, the semiconductor package can include a conductive pad disposed over a first dielectric layer having a conductive plug directly extended from the conductive pad through the first dielectric layer and protruded over a surface of the first dielectric layer from about 0 micron to about 50 microns or greater. In various embodiments, arrays of the conductive plugs can be formed for the semiconductor package and can be further connected to a printed circuit board. Various exemplary methods for forming the semiconductor package can include a through-hole metal deposition to form the conductive plugs.

Abstract: An apparatus and a method for removing coating layers from the top of alignment marks on a wafer are described. The apparatus includes a cleaning chamber that is a cavity and a lid member suspended in the cavity, a wafer chuck that is rotatably mounted in the lid member for holding a wafer in an upside down position such that the alignment marks are facing downwardly, and at least two solvent dispensing arms mounted in an outer peripheral area of the lid member that are immediately adjacent to the chuck for dispensing a flow of solvent upwardly toward the active surface of the wafer when the wafer is held in a stationary position, each of the at least two solvent dispensing arms are positioned corresponding to a position of one of the alignment marks.

Abstract: An apparatus and a method for removing coating layers from the top of alignment marks on a wafer are described. The apparatus includes a cleaning chamber that is a cavity and a lid member suspended in the cavity, a wafer chuck that is rotatably mounted in the lid member for holding a wafer in an upside down position such that the alignment marks are facing downwardly, and at least two solvent dispensing arms mounted in an outer peripheral area of the lid member that are immediately adjacent to the chuck for dispensing a flow of solvent upwardly toward the active surface of the wafer when the wafer is held in a stationary position, each of the at least two solvent dispensing arms are positioned corresponding to a position of one of the alignment marks.