Patents by Inventor Aaron D. Kuan

Aaron D. Kuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8399781
    Abstract: An electronic device includes at least one terminal formed on the electronic device. The electronic device also includes at least one of a semiconductor device, an integrated circuit chip, and a computer. A seamless conductive mesh is formed on at least one surface of the electronic device. The conductive mesh is in electrical contact with the terminal. The terminal facilitates electrical conduction between the conductive mesh and an electrical detection circuit. The electronic device also may include a pattern having traces formed on at least two surfaces where each of the traces includes a continuous loop of conductive material is formed on at least two surfaces. The electronic device also may include a first plurality of conductive loops formed on the electronic device that are continuous and surround the electronic device in a first direction and a second plurality of conductive loops formed on the electronic device that are continuous and surround the electronic device in a second direction.
    Type: Grant
    Filed: March 10, 2011
    Date of Patent: March 19, 2013
    Assignee: Teledyne Technologies Incorporated
    Inventors: Cuong V. Pham, David E. Chubin, Robert A. Clarke, Aaron D. Kuan
  • Patent number: 8268668
    Abstract: A method of fabricating an electronic circuit including forming a first depression on a first surface of a first wafer and forming a second depression on the first surface of the first wafer. The second depression is adjacent the first depression and separated from the first depression by a wall. The method further includes locating an actuator on the wall and attaching a first surface of a second wafer to the first surface of the first wafer to cover the first and second depressions. A first portion of the second wafer and the first depression define a first reservoir to contain a first chemical, and a second portion of the second wafer and the second depression define a second reservoir to contain a second chemical.
    Type: Grant
    Filed: April 9, 2010
    Date of Patent: September 18, 2012
    Assignee: Teledyne Technologies Incorporated
    Inventors: Cuong V. Pham, David E. Chubin, Aaron D. Kuan, Colleen L. Khalifa
  • Patent number: 8240038
    Abstract: A method including positioning an electronic device proximate a second device, the electronic device including at least one of a semiconductor device, an integrated circuit chip, and an electronic substrate, and the second device activatable to form a conductive pattern on the electronic device. The method further includes activating the second device to form the conductive pattern and forming the conductive pattern on at least two surfaces of the electronic device. The conductive pattern includes one or more than one conductive trace. Each conductive trace includes a conductive material and is continuous between at least two surfaces of the electronic device. Each conductive trace is formed by controlling relative movement of the electronic device and the second device during activation of the second device.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: August 14, 2012
    Assignee: Teledyne Technologies Incorporated
    Inventors: Cuong V. Pham, David E. Chubin, Robert A. Clarke, Aaron D. Kuan
  • Patent number: 7947911
    Abstract: A method of forming an anti-tamper mesh on an electronic device. The method includes forming at least one terminal on the electronic device and forming a conductive mesh on at least one surface of the electronic device, wherein the conductive mesh is in electrical contact with the terminal, and wherein the terminal facilitates electrical conduction between the conductive mesh and an electrical detection circuit.
    Type: Grant
    Filed: November 26, 2007
    Date of Patent: May 24, 2011
    Assignee: Teledyne Technologies Incorporated
    Inventors: Cuong V. Pham, David E. Chubin, Robert A. Clarke, Aaron D. Kuan
  • Patent number: 7705439
    Abstract: A semiconductor chip includes a first integrated circuit chip and a depression substrate attached to the integrated circuit chip, wherein the integrated circuit chip and the depression substrate define a cavity therebetween. The semiconductor chip also includes a stress sensitive material located in the cavity and a chemical located in the cavity, wherein detection of tampering causes a reaction by the chemical such that the semiconductor chip is at least partially destroyed.
    Type: Grant
    Filed: January 25, 2005
    Date of Patent: April 27, 2010
    Assignee: Teledyne Technologies Incorporated
    Inventors: Cuong V. Pham, David E. Chubin, Aaron D. Kuan, Colleen L. Khalifa
  • Publication number: 20100032776
    Abstract: A semiconductor chip includes a first integrated circuit chip and a depression substrate attached to the integrated circuit chip, wherein the integrated circuit chip and the depression substrate define a cavity therebetween. The semiconductor chip also includes a stress sensitive material located in the cavity and a chemical located in the cavity, wherein detection of tampering causes a reaction by the chemical such that the semiconductor chip is at least partially destroyed.
    Type: Application
    Filed: January 25, 2005
    Publication date: February 11, 2010
    Inventors: Cuong V. Pham, David E. Chubin, Aaron D. Kuan, Colleen L. Khalifa
  • Patent number: 7640658
    Abstract: A method of forming an anti-tamper mesh on an electronic device. The method includes forming at least one terminal on the electronic device and forming a conductive mesh on at least one surface of the electronic device, wherein the conductive mesh is in electrical contact with the terminal, and wherein the terminal facilitates electrical conduction between the conductive mesh and an electrical detection circuit.
    Type: Grant
    Filed: October 18, 2005
    Date of Patent: January 5, 2010
    Assignee: Teledyne Technologies Incorporated
    Inventors: Cuong V. Pham, David E. Chubin, Robert A. Clarke, Aaron D. Kuan