Patents by Inventor Aaron D. Poteet

Aaron D. Poteet has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Advanced polymers on metal printed wiring board
    Patent number: 4963697
    Abstract: A printed wiring board is comprised of a combination of layers providing a good thermal match with surface mount components. The board consists of a core surrounded by multiple layers of dielectric and conductive materials optimized for their thermal expansion qualities. The core is also used as the tooling plate during manufacture. Side-to-side interconnects are made by blind-plated vias and through-holes in the core.
    Type: Grant
    Filed: February 12, 1988
    Date of Patent: October 16, 1990
    Assignee: Texas Instruments Incorporated
    Inventors: Robert K. Peterson, Larry J. Mowatt, Aaron D. Poteet
  • Thermal interface for a printed wiring board
    Patent number: 4882454
    Abstract: A printed wiring board is comprised of a combination of layers providing a good thermal match with surface mount components. The board consists of a core surrounded by multiple layers of dielectric and conductive materials optimized for their thermal expansion qualities. The core is also used as a heat sink for drawing excess heat from the components. An integral thermal interface region is used to dissipate the heat from the core.
    Type: Grant
    Filed: February 12, 1988
    Date of Patent: November 21, 1989
    Assignee: Texas Instruments Incorporated
    Inventors: Robert K. Peterson, Larry J. Mowatt, Aaron D. Poteet