Abstract: The disclosed technology generally relates to metallization of substrates, and more particularly to selective metallization of ceramic substrates. A method of selectively metallizing a substrate includes forming a base metal layer comprising a refractory metal on a substrate, forming a base nickel (Ni) layer over the base metal layer by a vapor phase process, forming a palladium (Pd) layer on the base Ni layer by electroless plating, and forming a gold (Au) layer on the Pd layer.

Abstract: The disclosed technology generally relates to metallization of substrates, and more particularly to selective metallization of ceramic substrates without using a magnetic metal such as nickel (Ni). A ceramic package configured to house an electronic device. The ceramic package comprises a ceramic substrate and a non-magnetic metallization stack formed on the ceramic substrate. The non-magnetic metallization stack comprises a base metal layer formed on the ceramic substrate, a palladium (Pd)-based layer formed on the base metal layer, and a gold (Au)-based layer formed on the Pd-based layer. The non-magnetic metallization stack does not include a magnetic metal layer.

Abstract: The disclosed technology generally relates to metallization of substrates, and more particularly to selective metallization of ceramic substrates. A method of selectively metallizing a substrate includes forming a base metal layer comprising a refractory metal on a substrate, forming a base nickel (Ni) layer over the base metal layer by a vapor phase process, forming a palladium (Pd) layer on the base Ni layer by electroless plating, and forming a gold (Au) layer on the Pd layer.

Abstract: The disclosed technology generally relates to metallization of substrates, and more particularly to selective metallization of ceramic substrates. A method of selectively metallizing a substrate includes forming a base metal layer comprising a refractory metal on a substrate, forming a base nickel (Ni) layer over the base metal layer by a vapor phase process, forming a palladium (Pd) layer on the base Ni layer by electroless plating, and forming a gold (Au) layer on the Pd layer.

Abstract: The disclosed technology generally relates to metallization of substrates, and more particularly to selective metallization of ceramic substrates. A method of selectively metallizing a substrate includes forming a base metal layer comprising a refractory metal on a substrate, forming a base nickel (Ni) layer over the base metal layer by a vapor phase process, forming a palladium (Pd) layer on the base Ni layer by electroless plating, and forming a gold (Au) layer on the Pd layer.

Abstract: Apparatuses are provided that eliminate microbes in a prosthetic liner. Apparatuses are provided that eliminate odors and moisture from a prosthetic liner. Apparatuses and methods disclosed illuminate prosthetic liners with anti-microbial lights and push air past the prosthetic liners.

Abstract: According to various aspects, exemplary embodiments are provided of current chokes suitable for use in DC to DC converters. For example, a current choke may include a ferrite body with at least one pair of laterally spaced-apart interior conductors disposed lengthwise within the body. A first pair of end terminations may be disposed on a first end of the body and connected to the interior conductors, and a second pair of end terminations may be disposed on a second end of the body and connected to the interior conductors. A nonmagnetic dielectric may be disposed within the body laterally between the interior conductors. The nonmagnetic dielectric may be configured to control magnetic coupling between the at least one pair of interior conductors so that the current choke is operable with a coefficient of magnetic coupling between the interior conductors of less than about 0.90.