Abstract: The present invention relates to a method of applying dye and stainblocker to a substrate comprising cationically dyeable fibers which reduces or eliminates the need for subsequent reapplication of dye. The present invention solves the problem of cationic dye removal resulting from stainblocker application by providing a method wherein application of stainblocker precedes the application of dye to a substrate comprising cationically dyeable fibers. Surprisingly, the invention provides a method wherein the effectiveness of cationic dye application is improved when preceded by stainblocker application compared to stainblocker application preceded by cationic dye application. The substrate comprising cationically dyeable fibers preferably further comprises acid dyeable fibers wherein even more preferably, said cationically dyeable fibers and acid dyeable fibers are attached to a backing to form a carpet.

Abstract: Methods for generating putative ligand structures capable of altering the activity of a target effector molecule comprise: constructing an elongated monomer of the target effector molecule; constructing a three dimensional model of the target effector molecule under the influence of elongation using empirical three dimensional data, the model including a conformation revealing the binding portion of the target effector molecule to a putative ligand structure; generating a plurality of computational models of the target effector molecule; filtering the plurality of computational models against the three dimensional model created experimentally using a reiterative simulation analysis algorithm operable to identify and select a plurality of computational models having a root-mean square deviation below a predetermined threshold when compared to the three dimensional model of the target effector molecule; screening a plurality of ligands to rank the binding strength of each ligand with the plurality of computatio

Abstract: One embodiment relates to a method of fabricating an integrated circuit. In the method, p-type polysilicon is provided over a semiconductor body, where the p-type polysilicon has a first depth as measured from a top surface of the p-type polysilicon. An n-type dopant is implanted into the p-type polysilicon to form a counter-doped layer at the top-surface of the p-type polysilicon, where the counter-doped layer has a second depth that is less than the first depth. A catalyst metal is provided that associates with the counter-doped layer to form a catalytic surface. A metal is deposited over the catalytic surface. A thermal process is performed that reacts the metal with the p-type polysilicon in the presence of the catalytic surface to form a metal silicide. Other methods and devices are also disclosed.

Abstract: One embodiment relates to a method of fabricating an integrated circuit. In the method, p-type polysilicon is provided over a semiconductor body, where the p-type polysilicon has a first depth as measured from a top surface of the p-type polysilicon. An n-type dopant is implanted into the p-type polysilicon to form a counter-doped layer at the top-surface of the p-type polysilicon, where the counter-doped layer has a second depth that is less than the first depth. A catalyst metal is provided that associates with the counter-doped layer to form a catalytic surface. A metal is deposited over the catalytic surface. A thermal process is performed that reacts the metal with the p-type polysilicon in the presence of the catalytic surface to form a metal silicide. Other methods and devices are also disclosed.

Abstract: A method for manufacturing a semiconductor device that comprises forming an interconnect structure in an insulating layer located on a semiconductor substrate. The method also comprises depositing a metal cap layer on the interconnect structure and measuring a magnetic property of the metal cap layer. The magnetic property is compared to a target magnetic property. If the measured magnetic property differs from the target magnetic property by a predefined amount, then one or both of an interconnect structure formation process or a metal cap layer deposition process are altered.

Abstract: The present invention relates to a method of applying dye and stainblocker to a substrate comprising cationically dyeable fibers which reduces or eliminates the need for subsequent reapplication of dye. The present invention solves the problem of cationic dye removal resulting from stainblocker application by providing a method wherein application of stainblocker precedes the application of dye to a substrate comprising cationically dyeable fibers. Surprisingly, the invention provides a method wherein the effectiveness of cationic dye application is improved when preceded by stainblocker application compared to stainblocker application preceded by cationic dye application. The substrate comprising cationically dyeable fibers preferably further comprises acid dyeable fibers wherein even more preferably, said cationically dyeable fibers and acid dyeable fibers are attached to a backing to form a carpet.

Abstract: The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.

Abstract: Paint applicator having improved cleanability and paint-carrying capacity wherein the paint-carrying surface is coated or treated with a fluoroacrylate polymer or copolymer, a fluorourethane polymer or copolymer, or a mixture thereof, and a method for treating such paint applicators are disclosed.

Abstract: The present invention provides a method for manufacturing an interconnect and an integrated circuit. The method for manufacturing the interconnect, in one embodiment, includes forming a first metal feature (310) over a substrate, subjecting the first metal feature (310) to a hydrogen containing plasma (410), the hydrogen containing plasma (410) configured to remove organic residue (320) from an exposed surface of the first metal feature (310), and electroless depositing a second metal feature (510) on the first metal feature (310) having been subjected to the hydrogen containing plasma (410).

Abstract: Apparatus and methods for practicing telemedicine in the form of software systems acting over a network and kits containing laboratory supplies and equipment to organize the laboratory operations and interpret the results of molecular diagnostic testing are disclosed. At least two computers in communication over the Internet or other network are used, a remote computer located at a remote site and a central server located at a central site. The remote site may be geographically distant from the central site. A specimen is procured from a patient proximate to the remote site. Laboratory operations are conducted on the specimen at the remote site. The laboratory data resulting from the laboratory operations is interpreted by an expert reviewer who may be located at the central site, and a report is then transmitted back to the remote site.

Abstract: Apparatus and methods for practicing telemedicine in the form of software systems acting over a network and kits containing laboratory supplies and equipment to organize the laboratory operations and interpret the results of molecular diagnostic testing are disclosed. At least two computers in communication over the Internet or other network are used, a remote computer located at a remote site and a central server located at a central site. The remote site may be geographically distant from the central site. A specimen is procured from a patient proximate to the remote site. Laboratory operations are conducted on the specimen at the remote site. The laboratory data resulting from the laboratory operations is interpreted by an expert reviewer who may be located at the central site, and a report is then transmitted back to the remote site.

Abstract: Methods and compositions for preparation of biological samples are disclosed. The methods include a prelysis step and a lysis step to make the cellular DNA available for further processing, amplification or analysis. The prelysis step includes the addition of a prelysis reagent to the cells. The prelysis reagent may include an enzyme to facilitate the disruption of the cells. The lysis step includes the addition of a lysis reagent to at least a portion of the prelysis reagent and cells.

Abstract: A two-dimensional substantially quadrupole field is established and maintained to trap a selected group of ions. The field has a quadrupole harmonic with amplitude A2, and a higher order harmonic with an amplitude AN, AN being greater than 0.1%. The selected group of ions are trapped in the field. An oscillation frequency at a selected amplitude of excitation for the selected group of ions is determined. An excitation field at the selected amplitude of excitation is added to the two-dimensional substantially quadrupole field to deplete ions within a depletion peak having a low frequency side slightly above the oscillation frequency at the selected amplitude of excitation for the selected group of ions.

Abstract: The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.

Abstract: The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.

Abstract: The present invention provides a system for removing organic contaminants (216) from a copper seed layer that has been deposited on a semiconductor substrate (206). The present invention provides a housing (204) to enclose the semiconductor substrate within. An ultraviolet radiation source (210) is disposed within the housing. A treatment medium (208) is also provided within the housing. The semiconductor substrate is enclosed within the housing and exposed to the treatment medium. The ultraviolet radiation source exposes the semiconductor substrate to ultraviolet radiation, desorbing the contaminants from the seed layer.

Abstract: The present invention provides a system for removing surface contaminants from a copper seed layer disposed upon a semiconductor substrate (210), in preparation for electrochemical deposition. An electrochemical deposition apparatus (202) is provided, having a contaminant remediation module (204) housed within. The semiconductor substrate (210) is transferred into the remediation module (204), where it is exposed in a reactive remediation system (216). Contaminants are removed from the surface of the copper seed layer, followed by an immediate transfer (212) of the substrate (210) from the remediation module (204) into a plating system (208) also housed within the electrochemical deposition apparatus (202).

Abstract: The invention involves creation of an integrated genetic testing kit. The kit combines materials and components to aid in performance of each of the steps in a genetic assay. Additionally, the invention describes a variety of electronic tools and adjunct materials to make easier the collection and organization of patient related information that is used in interpretation of the analytic genetic data. One aspect of this invention is as a stand-alone integrated test kit, the test results of which may be in the form of fluoroscopic output. Another aspect of this invention is a telemedicine model. In this model, the invention is a larger genetic testing system in which procurement of genetic material, its testing, and its interpretation may occur at different locations. The telemedicine model comprises the integrated kit, instrumentation, and an electronic transmission system for delivery of the genetic test data to a remote data system where it is interpreted and a report is generated.