Abstract: An integrated circuit (IC) device comprises a substrate comprising a glass core. The glass core includes a first surface, a second surface opposite the first surface, a sidewall between the first surface and the second surface, and a corner region where the first sidewall meets the first surface. A first build-up layer is on at least the first surface. In some embodiments, the corner region comprises a recess and a dielectric material within the recess. In other embodiments, the corner region comprises a first compressive stress and the glass core comprises a second region. The second region comprises a second compressive stress. The first compressive stress is greater than the second compressive stress.

Abstract: Embodiments disclosed herein include package substrates and methods of forming such substrates. In an embodiment, a package substrate comprises a core, a first layer over the core, where the first layer comprises a metal, and a second layer over the first layer, where the second layer comprises an electrical insulator. In an embodiment, the package substrate further comprises a third layer over the second layer, where the third layer comprises a dielectric material, and where an edge of the core extends past edges of the first layer, the second layer, and the third layer.