Patents by Inventor Aaron HAHN

Aaron HAHN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11963308
    Abstract: The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: April 16, 2024
    Assignee: Atotech Deutschland Gmbh & Co. KG
    Inventors: Norbert Lützow, Wonjin Cho, Toshio Honda, Dirk Tews, Markku Lager, Felix Tang, Mirko Kloppisch, Aaron Hahn, Gabriela Schmidt, Martin Thoms
  • Publication number: 20210251085
    Abstract: The present invention relates to a method for increasing adhesion strength between a surface of copper or copper alloy and an organic layer, the method comprising in this order the steps: (i) providing a non-conductive substrate comprising on at least one side said surface, said surface having a total surface area of copper or copper alloy, (ii) contacting said substrate comprising said surface with an acidic aqueous non-etching protector solution comprising (ii-a) one or more than one amino azole, (ii-b) one or more than one organic acid and/or salts thereof, (ii-c) one or more than one peroxide in a total amount of 0.4 wt-% or less, based on the total weight of the protector solution, and (ii-d) inorganic acids in a total amount of 0 to 0.01 wt-%, based on the total weight of the protector solution, wherein during step (ii) the total surface area of said surface is not increased upon contacting with the protector solution.
    Type: Application
    Filed: May 6, 2019
    Publication date: August 12, 2021
    Inventors: Norbert LÜTZOW, Wonjin CHO, Toshio HONDA, Dirk TEWS, Markku LAGER, Felix TANG, Mirko KLOPPISCH, Aaron HAHN, Gabriela SCHMIDT, Martin THOMS