Patents by Inventor Aaron Ka Hoo Poon

Aaron Ka Hoo Poon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230097575
    Abstract: A controller system including a first controller including one or more input controls and a connector. The controller system also can include a second controller including one or more input controls and a connector. The controller system additionally can include a bridge including a first connector at a first end of the bridge, a second connector at a second end of the bridge, and one or more hub connectors between the first end and the second end of the bridge. Each of the first connector, the second connector, and the one or more hub connectors can be a first connector type. Each of the connectors of the first controller and the second controller can be a second connector type configured to connect in a positionally secure manner with the first connector type. Other embodiments are described.
    Type: Application
    Filed: September 23, 2022
    Publication date: March 30, 2023
    Applicant: Belkin International, Inc.
    Inventors: John Norton, Rosanne Sanfilippo, Kenneth Mori, Steven Lane, Aaron Ka Hoo Poon, Stanley Cheung, Seung Hyun Lim, Eric Lee, Vijendra Nalwad, Glenn Arche
  • Publication number: 20210252770
    Abstract: A machine including an adjustable cradle configured to hold, individually at different times, electronic devices having different dimensions. The machine also can include an alignment base configured to engage, individually at different times, with alignment mechanisms of overlay applicators. Each respective one of the overlay applicators can include a respective overlay configured to be applied to a respective surface of each of the electronic devices. The machine can be configured to facilitate applying, individually at different times, the respective overlays to the respective surfaces of the electronic devices. Other embodiments are described.
    Type: Application
    Filed: February 19, 2021
    Publication date: August 19, 2021
    Applicant: Belkin International, Inc.
    Inventors: Eric Lee, Stanley Cheung, Steven Lane, Kazuyoshi Raijin Otani, David A. Kleeman, John F. Wadsworth, Aaron Ka Hoo Poon