Abstract: A system and method for efficiently designing a through silicon via (TSV) macro blocks are described. In various implementations, the circuitry of a processor executes instructions of a place and route tool that provides automatic placement of macro blocks and standard cells on an integrated circuit die based on a copy of a netlist of the integrated circuit being designed and a copy of a standard cell library that includes a variety of standard cells and macro blocks. The processor places two functional macros in the floorplan with a channel between them. In the channel, the processor places a TSV macro that includes at least one boundary cell inside of the TSV macro. The processor prevents placement of a boundary cell adjacent to at least one side of the TSV macro despite empty space exists due to no standard cells or macros about the at least one side.

Abstract: Systems and methods for implementing voltage supply noise analysis for electronic circuits are disclosed. In an exemplary embodiment a computer program product executes a computer process. The computer process generates at least one spatial profile for the electronic circuit, generates at least one temporal profile for the electronic circuit, merges the at least one temporal profile and the at least one spatial profile, and determines if the electronic circuit is operating within acceptable voltage noise margins based on the merged temporal and spatial profiles.