Abstract: A respiratory protection device can be used to cover a portion of a face of a human user including the mouth or the nostrils of the user, or both. The device can include a shell and inserts embedded therein. The inserts can be formed of a thermoformable material embedded in the shell. The inserts are capable of being heated to a moldable temperature of the thermoformable material and form-fitted to a portion of the face of the user such that the shell creates a seal around at least the mouth or the nostrils of the user. Also, the thermoformable material can be moldable at a temperature safe to contact skin of the user such as by having a Young's modulus from a range of 0.03 GPa to 1 GPa at temperatures of less than 30° C. Also, the device can include a filter medium attached to the shell.

Abstract: In general, some embodiments include an apparatus, as well as methods and systems thereof, that can detect particles using a condensation particle counter having a laser configured to produce a laser beam. The apparatus can also include a photodetector configured to detect light scattered from the laser beam after the beam hits a particle in a test fluid. More specifically, in some embodiments, the apparatus can detect particles using a fixed laser within the condensation particle counter. Also, in some embodiments, the apparatus can detect particles using a laser configured to produce a focused laser beam that is focused along at least two axes. And, more specifically, in some embodiments, the apparatus can detect particles using a fixed laser within the condensation particle counter that is configured to produce a focused laser beam that is focused along at least two axes.

Abstract: With respect to some embodiments, described herein is an apparatus for the growth and detection of particles suspended in a gas stream, using a working condensation fluid that has a Lewis number greater or less than unity. The apparatus can include a saturation chamber and a condensation chamber and can produce particle growth by way of a system which offers bidirectional temperature control of both chambers. The apparatus can include a detection system of particles in a detection chamber. A test fluid carrying the particles can pass through the detection chamber and be separated from the detection system with a barrier fluid that is also passing through the detection chamber.

Abstract: A method of interconnecting multiple components of an electrical assembly with a solder joint that includes the steps of positioning a suspension adjacent to a slider to provide a connection area between the suspension and the slider, wherein the suspension comprises a pre-deposited quantity of solder material with a height that provides for a predefined gap between a lower surface of the slider and an upper surface of the solder material, and applying energy to the solder material to melt the solder material and allow it to move toward and contact the lower surface of the slider.

Abstract: Methods are described for forming a mounting surface on a slider body. In one method, an adhesion layer can be deposited on a top surface of a slider body. A first photolithography cycle deposits a first metal layer having a first thickness of at least 8 ?m. A second photolithography cycle deposits a second metal layer having a second thickness of at least 8 ?m over the first metal layer. The first and second layer form a mounting support on the top surface. In another method, the top surface is etched to form a mounting support.

Abstract: A slider includes a slider body with an air-bearing surface and a top surface opposing the air-bearing surface. A plurality of slider bond pads are disposed on or parallel to the top surface and proximate to or at a trailing edge of the slider. The plurality of slider bond pads have an exposed surface facing away from the top surface of the slider body. One or more mounting supports extend from the top surface to a distance of at least 12 ?m above the exposed surface of the plurality of slider bond pads.

Abstract: A method of controlling a shape and size of at least one solder joint of a magnetic recording head that includes a trailing surface and a plurality of bond pads, wherein each bond pad comprises a base layer comprising a top surface and a top edge, the method including the steps of forming at least one solder dam by covering a portion of the top surface of the base layer of at least one of the bond pads with a coating layer that comprises a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads, thereby defining a coated portion and an uncoated portion of the base layer, and applying solder material to the uncoated portion of the base layer adjacent to the solder dam so that the coating layer constrains movement of the solder material beyond the uncoated portion.

Abstract: A magnetic recording head is provided including a body with a trailing surface, a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes a base layer having a top surface, a coating layer covering at least a portion of the top surface of the base layer, two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, a top edge extending between the two side edges, and at least one solder dam comprising a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads.

Abstract: A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.

Abstract: A magnetic recording head including a trailing surface and a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, and a top edge extending between the two side edges. The head further includes at least one solder dam including a nonwettable, electrically conductive solder material positioned adjacent to the top edge of at least one of the bond pads.

Abstract: A method for interconnecting multiple components of an electrical assembly with a solder joint, including the steps of positioning a first component adjacent to a second component to provide a connection area, dispensing a solid solder sphere to a capillary tube, wherein the capillary tube is positioned with an exit orifice above the connection area between the first and second components, applying a first laser through the capillary tube while measuring light from the first laser that reflects off the connection area as the solder sphere moves through the capillary tube, and applying a second laser to at least partially melt the solder sphere when the measured light decreases to a predetermined level and as the solder sphere falls from the exit orifice toward the connection area between the first and second components.

Abstract: A method for forming an electrical interconnection between a slider pad and a suspension pad that is adjacent to and positioned at an angle relative to the slider pad, which includes the steps of forming a solder bump on a first surface of the slider pad, reshaping the solder bump into a protrusion having an ellipsoidal shape that extends from the slider pad and contacts the suspension pad, and applying a laser to the ellipsoidal protrusion to reflow the solder bump while simultaneously applying a downward pressure to the solder bump in order to form a solder fillet between the slider pad and the suspension pad.