Abstract: A burn-in board for burn-in testing of semiconductor devices includes a strip socket mounted to a PCB. The strip socket includes a socket base configured to receive a device strip including an array of semiconductor devices, and a socket lid including at least one heating block. The socket lid is movable moved between (a) an open position allowing the device strip to be mounted on the socket base and (b) a closed position in which the socket lid including the heating block(s) is closed down on the mounted device strip. The strip socket includes conductive contacts configured to contact individual semiconductor devices on the device strip to allow selective monitoring of individual semiconductor devices during a burn-in test process. The burn-in board may also include heating control circuitry to control the heating block(s) during the burn-in test process.

Abstract: A burn-in board for burn-in testing of semiconductor devices includes a strip socket mounted to a PCB. The strip socket includes a socket base configured to receive a device strip including an array of semiconductor devices, and a socket lid including at least one heating block. The socket lid is movable moved between (a) an open position allowing the device strip to be mounted on the socket base and (b) a closed position in which the socket lid including the heating block(s) is closed down on the mounted device strip. The strip socket includes conductive contacts configured to contact individual semiconductor devices on the device strip to allow selective monitoring of individual semiconductor devices during a burn-in test process. The burn-in board may also include heating control circuitry to control the heating block(s) during the burn-in test process.