Patents by Inventor Aaron Parker

Aaron Parker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for dicing released MEMS wafers
    Patent number: 6830990
    Abstract: Various embodiments are methods and apparatuses for different steps in separating wafers into multiple wafer die. Some embodiments are adapted for dicing wafers having a front side and a back side, where the front side has processed devices, such as MEMS devices.
    Type: Grant
    Filed: August 7, 2002
    Date of Patent: December 14, 2004
    Assignee: LightConnect, Inc.
    Inventors: Kenneth Honer, Aaron Parker, Daniel G. Parker