Patents by Inventor Aaron Pirner

Aaron Pirner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Modular floor installation system and method
    Patent number: 11975525
    Abstract: A system and method of a modular floor assembly and installation on an aircraft is presented in embodiments herein. A floor assembly comprising an underlayment layer and a decorative layer may be assembled to provide an aircraft floor that meets Federal Aviation Regulations. The floor assembly may comprise structural, adhesive, and magnetic layers creating a floor assembly that may be quickly and easily removable for maintenance and access to compartments below the floor assembly.
    Type: Grant
    Filed: October 5, 2022
    Date of Patent: May 7, 2024
    Assignee: CAP Carpet, Inc.
    Inventor: Aaron Pirner
  • MODULAR FLOOR INSTALLATION SYSTEM AND METHOD
    Publication number: 20230044999
    Abstract: A system and method of a modular floor assembly and installation on an aircraft is presented in embodiments herein. A floor assembly comprising an underlayment layer and a decorative layer may be assembled to provide an aircraft floor that meets Federal Aviation Regulations. The floor assembly may comprise structural, adhesive, and magnetic layers creating a floor assembly that may be quickly and easily removable for maintenance and access to compartments below the floor assembly.
    Type: Application
    Filed: October 5, 2022
    Publication date: February 9, 2023
    Inventor: Aaron Pirner
  • Modular floor installation system and method
    Patent number: 11479334
    Abstract: A system and method of a modular floor assembly and installation on an aircraft is presented in embodiments herein. A floor assembly comprising an underlayment layer and a decorative layer may be assembled to provide an aircraft floor that meets Federal Aviation Regulations. The floor assembly may comprise structural, adhesive, and magnetic layers creating a floor assembly that may be quickly and easily removable for maintenance and access to compartments below the floor assembly.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: October 25, 2022
    Assignee: CAP Carpet, Inc.
    Inventor: Aaron Pirner
  • MODULAR FLOOR INSTALLATION SYSTEM AND METHOD
    Publication number: 20200001967
    Abstract: A system and method of a modular floor assembly and installation on an aircraft is presented in embodiments herein. A floor assembly comprising an underlayment layer and a decorative layer may be assembled to provide an aircraft floor that meets Federal Aviation Regulations. The floor assembly may comprise structural, adhesive, and magnetic layers creating a floor assembly that may be quickly and easily removable for maintenance and access to compartments below the floor assembly.
    Type: Application
    Filed: May 17, 2019
    Publication date: January 2, 2020
    Inventor: Aaron Pirner