Abstract: A mount for mounting a door to rack includes a plate including a first end and a second end opposite the first end, and a hinge arm adjustably coupled with the plate and extending at an angle from a first side of the plate adjacent to the first end, the hinge arm including a door pin receptacle to receive a door pin therein for coupling the door to the rack via the plate.

Abstract: A electronic equipment rack assembly retractable door apparatus is disclosed, which may include channels, horizontally mounted at the top and bottom of an open side of the rack assembly, and latch plates mounted to the rack assembly. The retractable door apparatus may have movable door frame members, each having a housing with a cavity and a slot opening to the cavity, rollers attached to the housing and contained within the channels, designed to maintain the door frame member in a vertical orientation, a spool, attached within the housing, a spring configured provide a torsional tensioning force on the spool, and a latching door handle, attached to the housing to engage with the latch plate receptacles. The retractable door apparatus may also include a door material attached to the door frame member spools and configured to pass through the slots in the door frame member housings.

Abstract: A method is disclosed for manufacturing an electronic component carrier. The method comprises positioning a header of a frame between opposing attachment arms extending outwardly for attaching an electronic component for seating within the frame. Further, latching members of a latching mechanism of the frame are positioned at a distal end of each of the attachment arms for releaseably seating the electronic component. The attachment arms are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position for releasing and grasping the electronic component. Handling levers are positioned for removably mating the electronic component to a connector on a circuit board. The handling levers extend upwardly through an outer casing housing the circuit board when in an open position, and the handling levers are substantially parallel with a top surface of the header when in a closed position.

Abstract: A memory module cooling system includes a liquid cooled manifold assembly and a heat spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis perpendicular to the memory module. The liquid cooled manifold assembly includes a manifold, an liquid inlet, and a liquid outlet. The heat spreader assembly includes a base in thermal contact with a heat pipe, and a heat spreader in thermal contact with the heat pipe, the heat spreader configured to thermally engage the memory module. In certain embodiments, thermal bonds are maintained between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.

Abstract: An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.

Abstract: A rotating retention fixture for preventing the undesired removal of an electrical cable from a power strip includes a pronged clip, a first bracket, a second bracket each rotatable about a central axis and a fastener that restricts rotation between the first rotatable bracket and the second rotatable bracket. In order to prevent the undesired removal of the electrical cable from the power strip, the electrical cable may be inserted into the pronged clip, the rotating retention fixture may be positioned such that a bottom surface of the pronged clip is adjacent to the electrical cable, a first bracket and a second bracket of the rotating retention fixture may be rotated about the central axis to contact opposing sides of the power strip, respectively, and the fastener may be engaged to prevent rotation between the first bracket and the second bracket to retain the electrical cable to the power strip.

Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

Abstract: An electronic component carrier and method for mounting the electronic component to a circuit board includes a frame including a header having opposing attachment arms extending outwardly therefrom for seating an electronic component within the frame. A latching mechanism of the frame includes latching members at a distal end of each of the attachment arms for releasably seating the electronic component between the attachment members. The attachment members are resiliently flexible such that the latching members bend to a release position and resiliently return to a grasping position. Handling levers extend upwardly from the header through an outer casing housing the circuit board when in an open position for manually removing the electronic component from the connector, and the handling levers are substantially parallel with a top surface of the header when in a closed position when the electronic component is mated to the connector.

Abstract: An electronic device includes an opening in a cover, a sleeve extending from the opening to a circuit board, and a CPU assembly. The CPU assembly includes a CPU carrier and is insertable into the sleeve to connect the CPU carrier with a CPU connector upon the circuit board. A method of installing the CPU assembly into the electronic device includes inserting the CPU assembly into a an opening in a cover of the electronic device within a sleeve extending from the opening to a circuit board. A serviceable CPU assembly includes a CPU carrier thermally connected to an underside of a lower portion of a heat sink, a CPU assembly base including a plurality of guidance features to properly align CPU assembly during installation, and a handle assembly comprising at least one handle connected to an upper portion of the heat sink.

Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

Abstract: A mount for mounting a door to rack includes a plate including a first end and a second end opposite the first end, and a hinge arm adjustably coupled with the plate and extending at an angle from a first side of the plate adjacent to the first end, the hinge arm including a door pin receptacle to receive a door pin therein for coupling the door to the rack via the plate.

Abstract: A modular panel unit according to one embodiment includes a major subunit adapted for being secured to a keyed backing panel, and at least one minor subunit. The major subunit includes at least one connector adapted for coupling to a corresponding connection feature of the keyed backing panel in order to secure the major subunit to the keyed backing panel; and one or more coupling features. Each minor subunit includes: one or more couplers adapted for coupling to the one or more coupling features of the major subunit in order to secure the minor subunit to the major subunit. Additional systems and methods are also disclosed.

Abstract: A system includes a support rack and a component housing. The support rack includes a pair of vertically-extending panels, and each panel of the pair of vertically-extending panels has one or more first mating members of a water coupler pair extending outwardly from the support rack. The component housing is slidably disposed between the pair of vertically-extending panels and has a front panel, a pair of sidewalls extending rearwardly from the front panel, a component water line, and two second mating members of the water coupler pair connected to each other by the component water line.

Abstract: An RFID tag assembly for attachment to an enclosure surface including a door, an RFID tag attached to one face of the door or wrapped around the door, and an attachment device for connecting the door to the enclosure surface to allow the door to move to a position that shows both sides of the door. The RFID tag can include a ground plane, the tag wrapped around the door such that the ground plane is on the back of the door and the RFID tag antenna is on the front of the door. A ground plane can be provided on the enclosure inner or outer surface in alignment with the RFID tag antenna, with the antenna directly or inductively coupled to the ground plane when the door is in a closed position.

Abstract: A method and apparatus is provided for providing air to a rack system. In one embodiment, the apparatus may include a duct adapted to channel air into a receiving section of the rack system. The apparatus may also include an adjustable separator within the duct to direct incoming air into partitions corresponding to the receiving section of the rack system before exiting the duct. The adjustable separator may have an adjustability of length and have a paneling made of a flexible material.

Abstract: A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.

Abstract: Transportation packaging may be used to ship or transport a product, such as an electronic device. The transportation packaging may be reused subsequent to the transport of the product by removing a shape defined by a pattern included on the transportation packaging, assembling or altering a portion of the removed pattern, and engaging the assembled pattern with the product. In a particular embodiment, the assembled pattern may provide a usability surface for at least one peripheral device to be used with the electronic device.

Abstract: A modular panel unit according to one embodiment includes a major subunit adapted for being secured to a keyed backing panel, and at least one minor subunit. The major subunit includes at least one connector adapted for coupling to a corresponding connection feature of the keyed backing panel in order to secure the major subunit to the keyed backing panel; and one or more coupling features. Each minor subunit includes: one or more couplers adapted for coupling to the one or more coupling features of the major subunit in order to secure the minor subunit to the major subunit. Additional systems and methods are also disclosed.

Abstract: An apparatus and method is provided for conveying heat away from an electronic component. In one embodiment, a method positions a conformable thermal interface element in heat conducting contact with an electronic component. A heat conducting member is disposed within the conformable thermal interface element. The heat conducting member is coupled with a manifold so that the heat conducting member is in heat conducting contact with the manifold. The electronic component may be installed or removed without disassembly of the apparatus.

Abstract: Provided are a computer program product, system, and method promoting products in a virtual world. An association of product information for a product with a texture of an object assigned to the advertising user is provided for an advertising user. The product information with the texture of the object is rendered to be observable by interacting users in the virtual world when the texture of the object presenting the product information is within an observable range of avatars of the interacting users. Tracking information is updated for the advertising user in response to the texture of the object presenting the product information being within the observable range of the avatars of the interacting users. The tracking information generated for the advertising user is provided for use in determining rewards to assign to the advertising user for promoting the product.