Abstract: Disclosed is a computer enclosure that includes a shell disposed around a computer chassis, the shell comprising a plurality of elongate members disposed on an outer surface of the shell, the elongate members comprising thermally conductive material. The computer enclosure includes a front input/output (I/O) panel selectively coupled to a front side of the shell, the front I/O panel comprising at least one opening corresponding to an I/O port of a hardware computing component of the chassis. The computer enclosure includes a rear I/O panel selectively coupled to a rear side of the shell, the rear I/O panel comprising at least one opening corresponding to an I/O port of a hardware computing component of the chassis.

Abstract: Disclosed is a computer case with I/O panels on opposite sides of the case, and a method for providing the case. The case includes a top, a bottom, a back side that is opposite a front side, and a right side that is opposite a left side. The case also includes a front I/O opening formed in the front side that receives a front I/O panel. The computer case also includes a rear I/O opening in the back side that receives a rear I/O panel.

Abstract: Disclosed is a computer case with I/O panels on opposite sides of the case, and a method for providing the case. The case includes a top, a bottom, a back side that is opposite a front side, and a right side that is opposite a left side. The case also includes a front I/O opening formed in the front side that receives a front I/O panel. The computer case also includes a rear I/O opening in the back side that receives a rear I/O panel.