Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, where the printed circuit board has a first side and an opposite second side, a heat source located on the first side of the printed circuit board, a heatsink over the heat source, and one or more fasteners coupled to the heatsink. The one or more fasteners go through the printed circuit board and each of the one or more fasteners includes a printed circuit board securing area that extends along the second side of the printed circuit board to help secure the heatsink to the printed circuit board and create an applied load on the heat source. In an example, a thermal interface material layer less than about one hundred (100) micrometers in in thickness can be between the heat source and the heatsink.

Abstract: In one aspect, an apparatus comprises a first housing and a second housing. The first housing comprises a surface to receive heat from a heat-generating component. The second housing comprising a receptacle in which to receive the first housing. The first housing is to nest within the receptacle. The receptacle inhibits movement of the first housing along a first axis and facilitates movement of the first housing along a second axis. The first housing is moveable within the receptacle along the second axis. Movement of the first housing along the second axis changes a size of a gap between the surface and the heat-generating component.

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a printed circuit board, where the printed circuit board has a first side and an opposite second side, a heat source located on the first side of the printed circuit board, a heatsink over the heat source, and one or more fasteners coupled to the heatsink. The one or more fasteners go through the printed circuit board and each of the one or more fasteners includes a printed circuit board securing area that extends along the second side of the printed circuit board to help secure the heatsink to the printed circuit board and create an applied load on the heat source. In an example, a thermal interface material layer less than about one hundred (100) micrometers in in thickness can be between the heat source and the heatsink.

Abstract: In one aspect, an apparatus comprises a first housing and a second housing. The first housing comprises a surface to receive heat from a heat-generating component. The second housing comprising a receptacle in which to receive the first housing. The first housing is to nest within the receptacle. The receptacle inhibits movement of the first housing along a first axis and facilitates movement of the first housing along a second axis. The first housing is moveable within the receptacle along the second axis. Movement of the first housing along the second axis changes a size of a gap between the surface and the heat-generating component.