Abstract: A radiation detection device is provided. The radiation detection device includes a pair of rails spaced in a slice direction and extending parallel to a channel direction, and a plurality of collimator modules arranged along the channel direction on a radiation exit side of the pair of rails, wherein at least one of the pair of rails extending along the channel direction includes a plate member with a plurality of notches formed along the radiation exit side, and wherein the collimator modules each include a first pin protruding on a radiation incidence side and attached to the pair of rails with the first pin fitted in one of the notches of the plate member.

Abstract: Improved imaging systems are disclosed. More particularly, the present disclosure provides for an improved image sensor assembly for an imaging system, the image sensor assembly having an integrated photodetector array and its associated data acquisition electronics fabricated on the same substrate. By integrating the electronics on the same substrate as the photodetector array, this thereby reduces fabrications costs, and reduces interconnect complexity. Since both the photodiode contacts and the associated electronics are on the same substrate/plane, this thereby substantially eliminates certain expensive/time-consuming processing techniques. Moreover, the co-location of the electronics next to or proximal to the photodetector array provides for a much finer resolution detector assembly since the interconnect bottleneck between the electronics and the photodetector array is substantially eliminated/reduced.

Abstract: A method for manufacturing a high melting point metal based object includes providing pure high melting point metal based powder, fabricating a green object from the powder, by way of a laser sintering technique, providing infiltration treatment to the green object, and providing heating pressure treatment to the green object. The temperature to the green object is controlled to the re-sintering point of the green object.

Abstract: A collimator for an imaging system includes a first region comprising a first one-dimensional array of apertures along a channel direction, and a second region comprising a second one-dimensional array of apertures along the channel direction, wherein an aspect ratio of the apertures of the first region is greater than an aspect ratio of the second region.

Abstract: Detector modules for an imaging system and methods of manufacturing are provided. One detector module includes a substrate, a direct conversion sensor material coupled to the substrate and a flexible interconnect electrically coupled to the direct conversion sensor material and configured to provide readout of electrical signals generated by the direct conversion sensor material. The detector module also includes at least one illumination source for illuminating the direct conversion sensor material.

Abstract: Detector modules and methods of manufacturing are provided. One detector module includes a detector having a silicon wafer structure formed from a first layer having a first resistivity and a second layer having a second resistivity, wherein the first resistivity is greater than the second resistivity. The detector further includes a photosensor device provided with the first layer on a first side of the silicon wafer and one or more readout electronics provided with the second layer on a second side of the silicon wafer, with the first side being a different side than the second side.

Abstract: A CT system includes a rotatable gantry having an opening to receive an object to be scanned, an x-ray source configured to project an x-ray beam toward the object, and a detector array configured to detect x-rays passing through the object. The detector array includes a first array of pixels positioned to receive x-rays that pass to the detector array outside a first field-of-view (FOV) to a second FOV, the first array of pixels providing a first resolution, and a second array of pixels positioned to receive x-rays passing through the first FOV, the second array of pixels providing a second resolution that is different from the first resolution. The system includes a data acquisition system (DAS) configured to receive outputs from the detector array, and a computer programmed to acquire projections of imaging data of the object, and generate an image of the object using the imaging data.

Abstract: A system and method for temperature drift correction capability in a CT detector module is disclosed. A scintillator array of a CT detector module has a plurality of scintillator cells configured to detect high frequency electromagnetic energy passing through an object, with a plurality of photodiodes in a photodiode array optically coupled to the scintillator array to detect light output therefrom. A computer is provided that is programmed to measure a response of the plurality of photodiodes as a function of temperature, determine a transfer function indicative of the response of the plurality of photodiodes as a function of temperature, normalize the transfer function to a virtual operating temperature, measure a temperature of the photodiode array prior to a scan, determine a correction factor from the normalized transfer function based on the measured photodiode temperature and the virtual operating temperature, and apply the correction factor to the photodiode outputs.

Abstract: Photodiode arrays and methods of fabrication are provided. One photodiode array includes a silicon wafer having a first surface and an opposite second surface and a plurality of conductive vias through the silicon wafer. The photodiode array further includes a patterned doped epitaxial layer on the first surface, wherein the patterned doped epitaxial layer and the substrate form a plurality of diode junctions. A patterned etching defines an array of the diode junctions.

Abstract: Systems and methods for focal spot motion correction are provided. One system includes a radiation source configured to project radiation from a first focal spot onto an object and a plurality of radiation detectors disposed around at least a portion of the object. The plurality of radiation detectors measure received radiation along a path projected from the first focal spot to the plurality of detectors. The imaging system further includes an imaging region from which the detectors provide image information for image reconstruction and a plurality of collimators positioned between the object and the plurality of radiation detectors. At least one collimator at a first end of the plurality of collimators and at least one collimator at second end of the plurality of collimators are aligned to a second focal spot different than the first focal spot and having a different location.

Abstract: A radiation detection device is provided. The radiation detection device includes a pair of rails spaced in a slice direction and extending parallel to a channel direction, and a plurality of collimator modules arranged along the channel direction on a radiation exit side of the pair of rails, wherein at least one of the pair of rails extending along the channel direction includes a plate member with a plurality of notches formed along the radiation exit side, and wherein the collimator modules each include a first pin protruding on a radiation incidence side and attached to the pair of rails with the first pin fitted in one of the notches of the plate member.

Abstract: A source-side radiation detector (SSRD) includes a detector module assembly, and a monitoring lens coupled to the detector module assembly, the detector module assembly and the monitoring lens being positioned proximate to an x-ray source, the monitoring lens including a plurality of slits configured to receive x-rays therethrough from the x-ray source, the detector module assembly being configured detect the x-rays transmitted through the slits and to generate information to track a position of a focal spot of the x-ray source.

Abstract: Methods and apparatus for collimation of detectors in an imaging system are provided. One an imaging system includes a radiation source configured to project radiation from a focal spot onto an object and a plurality of radiation detectors disposed around at least a portion of the object. The plurality of radiation detectors detect received radiation along a path projected from the focal spot to the plurality of detectors. The imaging system also includes a plurality of collimators positioned between the object and the plurality of detectors, wherein the collimators have a tapered configuration.

Abstract: A photodiode element includes a first layer of a first diffusion type and a second layer. The second layer defines a charge-collecting area. The charge-collecting area includes an active region of a second diffusion type and an inactive region. The active region surrounds the inactive region. The photodiode element also includes an intrinsic semiconductor layer between the first layer and the second layer.

Abstract: A CT system is disclosed that includes detector modules positioned on a rotatable gantry configured to receive x-rays attenuated by an object. Each detector module includes a module frame, a plurality of tileable sub-modules on the module frame aligned along a Z-axis thereof to receive the x-rays attenuated by the object and convert the x-rays to digital signals, and an electronics board connected to the plurality of sub-modules to receive the digital signals. Each sub-module further includes an array of detector elements to receive x-rays attenuated through the object and convert the x-rays into analog electrical signals, an ASIC electronics package coupled to the array of detector elements to receive the analog electrical signals and convert the analog electrical signals to digital signals, and a flex circuit connected to the ASIC electronics package to receive the digital signals and transfer the digital signals to the electronics board.

Abstract: A radiation imaging apparatus is provided. The radiation imaging apparatus includes a radiation source configured to emit radiation from a first focal point, a plurality of radiation detecting elements disposed opposite to the radiation source and arranged in a channel direction, a plurality of collimator plates provided along the channel direction so as to separate the radiation detecting elements, the collimator plates including radiation absorption members at surfaces of at least one first collimator plate located on a first end side and at least one second collimator plate located on a second end side such that radiation shielding effects of the first and second collimator plates become substantially equivalent when the surfaces of the first and second collimator plates are located along a radial direction from a second focal point, and a data acquisition unit configured to acquire radiation projection data from the radiation detecting elements.

Abstract: Photodiode arrays and methods of fabrication are provided. One photodiode array includes a silicon wafer having a first surface and an opposite second surface. The photodiode array also includes a plurality of refilled conductive vias through the silicon wafer, wherein the refilled conductive vias have a doping type different than the doping type of the substrate, and an interface between the refilled conductive vias and the substrate form diode junctions. The photodiode array further includes a patterned doped layer on the first surface overlapping the refilled conductive vias, wherein the patterned doped layer defines an array of photodiodes.

Abstract: Photodiode arrays and methods of fabrication are provided. One photodiode array includes a silicon wafer having a first surface and an opposite second surface and a plurality of conductive vias through the silicon wafer. The photodiode array further includes a patterned doped epitaxial layer on the first surface, wherein the patterned doped epitaxial layer and the substrate form a plurality of diode junctions. A patterned etching defines an array of the diode junctions.

Abstract: An x-ray detector assembly includes a curved rail and a first plurality of x-ray attenuation plates attached to the curved rail, wherein the plates of the first plurality of x-ray attenuation plates are spaced apart from one another by a first pitch. A second plurality of x-ray attenuation plates are attached to the curved rail, wherein the plates of the second plurality of x-ray attenuation plates are spaced apart from the plates of the first plurality of x-ray attenuation plates by a second pitch greater than the first pitch. A first plurality of x-ray detector cells is also positioned adjacently to the first and second pluralities of x-ray attenuation plates and positioned in a linear arrangement with respect to each other.

Abstract: A CT system includes a rotatable gantry having an opening to receive an object to be scanned, the rotatable gantry having a detector mounting surface, an x-ray source attached to the gantry and configured to project an x-ray beam toward the object, a plurality of detector modules each mounted within one field-of-view (FOV) and mounted directly to the detector mounting surface of the rotatable gantry, a data acquisition system (DAS) configured to receive outputs from at least one of the plurality of detector modules, and a computer programmed to acquire projections of imaging data of the object from the DAS, and generate an image of the object using the imaging data.