Patents by Inventor Abderrahim EL AMRANI

Abderrahim EL AMRANI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HETEROGENEOUS SOLDER BUMP STRUCTURE
    Publication number: 20240113060
    Abstract: There is provided a solder bump structure comprising an under bump metallurgy (UBM) layer, a first solder portion over the UBM layer, the first solder portion having a first composition, a barrier layer encapsulating the first solder portion, and a second solder portion over the barrier layer, the second solder portion having a second composition different from the first composition.
    Type: Application
    Filed: February 22, 2021
    Publication date: April 4, 2024
    Inventors: Abderrahim EL AMRANI, Etienne PARADIS, David DANOVITCH, Dominique DROUIN, Valerie OBERSON, Michel TURGEON, Clement FORTIN