Patents by Inventor Abdolreza Nezamoleslami

Abdolreza Nezamoleslami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7850821
    Abstract: A household thin paper, that offers flexibility and further difficulty in tearing, comprising a polyester-based compound represented by General Formula (1): wherein R1 is HO— or HO(R2O)a-, R2 is an alkylene group having 2 or 3 carbon atoms, only a single type of R2O or two types of R2O can be attached randomly or as a block, “a” is 1 to 200, all “a”s may be same or different in an identical molecule, b is 2 to 100, and R3 is a hydrogen atom or the like.
    Type: Grant
    Filed: August 24, 2005
    Date of Patent: December 14, 2010
    Assignee: Daio Paper Corporation
    Inventors: Tetsuya Uehara, Akira Hirasawa, Hiroshi Ono, Abdolreza Nezamoleslami, Kazuaki Fujimori
  • Publication number: 20080207867
    Abstract: The household thin paper comprising a polyester-based compound represented by General Formula (1): wherein R1 is HO— or HO(R2O)a-, R2 is an alkylene group having 2 or 3 carbon atoms, only a single type of R2O or two types of R2O can be attached randomly or as a block, “a” is 1 to 200, all “a”s may be same or different in an identical molecule, b is 2 to 100, and R3 is a hydrogen atom or the like.
    Type: Application
    Filed: August 24, 2005
    Publication date: August 28, 2008
    Inventors: Tetsuya Uehara, Akira Hirasawa, Hiroshi Ono, Abdolreza Nezamoleslami, Kazuaki Fujimori
  • Publication number: 20080139754
    Abstract: A purpose of the invention is to provide a thermoplastic resin composition which enhances crystallization during molding, has high thermal deformation temperature, has high rigidity, induces less pealing on the molding surface, and gives excellent appearance, thus being preferably used as the facility parts of automobiles, and those of electric and electronics products. The (A) 100 parts by weight of a polyamide resin structured by the following monomers (1) and (2) is blended with (B) 5 to 100 parts by weight of a liquid crystalline polyester amide resin: (1) a diamine component containing an aliphatic diamine component unit having 4 to 12 carbon atoms arranged in straight chain and/or an aliphatic diamine component unit having 4 to 12 carbon atoms having side chain, and a derivative thereof; and (2) a dicarboxylic acid component containing 40 to 100% by mole of terephthalic acid component unit and 0 to 60% by mole of isophthalic acid component unit, and a derivative thereof.
    Type: Application
    Filed: August 29, 2005
    Publication date: June 12, 2008
    Applicant: POLYPLASTICS CO., LTD.
    Inventors: Tetsuya Uehara, Akira Hirasawa, Hiroshi Ono, Abdolreza Nezamoleslami, Kazuaki Fujimori