Abstract: The invention relates to storage-stable, thermosetting mixtures which contain polymaleimides, alkenylphenols and/or alkenylphenol ethers, epoxide compounds with or without allyl groups, and, optionally, curing accelerators for epoxide resins. These mixtures can be converted by curing into high-polymers which have excellent electrical properties (especially at high temperatures) and very good thermal properties.

Abstract: The invention relates to the manufacture of crosslinked polymers which contain imide groups by reacting polymaleimides with alkenylphenols or alkenylphenol ethers, preferably at temperatures of 100.degree. to 250.degree. C. The reaction mixture optionally also contains polymerization catalysts. The manufacture of the polymers is as a rule carried out with simultaneous shaping. Shaped articles (for example castings), laminates, adhesive bonds and foams can be manufactured in this way. It is also possible to carry out the reaction in solution.

Abstract: A process for the manufacture of printed multilayer circuits by coating carrier films, which possess metal layers, with a light-sensitive material containing a compound with epoxide groups and with groups which can be cured by electromagnetic rays, by exposing the light-sensitive material through a transparent film which shows the negative image of the conductor traces to be produced, by developing with an organic solvent, by etching the metal layer and pressing the laminates together to form a multi-layer circuit. The parts of the light-sensitive layer which have been pre-cured by exposure to light are subjected to a thermal after-treatment using a curing agent for epoxide groups, whereby these parts are post-cured. These parts are not removed from the carriers films.