Patents by Inventor Abdul Khader Rumaiz

Abdul Khader Rumaiz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240266382
    Abstract: A solid-state photomultiplier with a high-k dielectric hole blocking layer (HBL) is provided. The HBL may include a n-type material. The photomultiplier may comprise an amorphous selenium (a-Se) bulk layer. The HBL may be a non-insulating layer. The photomultiplier may also comprise an electron blocking layer (EBL). The EBL may comprise a p-type material. The p-type material may also have a high k dielectric. The a-Se layer may be sandwiched between the HBL and the EBL. Methods for manufacturing a solid-state photomultiplier are also provided.
    Type: Application
    Filed: May 19, 2022
    Publication date: August 8, 2024
    Applicants: THE RESEARCH FOUNDATION FOR THE STATE UNIVERSITY OF NEW YORK, BROOKHAVEN SCIENCE ASSOCIATES, LLC
    Inventors: Atreyo MUKHERJEE, Wei ZHAO, Amirhossein GOLDAN, Le Thanh Triet HO, Anthony R. LUBINSKY, Adrian HOWANSKY, Jann STAVRO, D. Peter SIDDONS, Abdul Khader RUMAIZ
  • Patent number: 11012642
    Abstract: A detecting apparatus includes a multi-tier 3D integrated ASIC comprising one or more analog tiers and one or more digital tiers, and a sensor bonded to the multi-tier 3D integrated ASIC. The detecting apparatus includes an electrical substrate and a group of FPGAs or custom data management ASICs. The detecting apparatus also includes a thermal management system, a power distribution system and one or more connectors to transfer data to a data acquisition system configured for radiation spectroscopy or imaging with zero suppressed or full frame readout.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: May 18, 2021
    Assignee: FERMI RESEARCH ALLIANCE, LLC
    Inventors: Farah Fahim, Grzegorz W. Deptuch, Pawel Grybos, Robert Szczygiel, Piotr Maj, Piotr Kmon, David Peter Siddons, Joseph Mead, Abdul Khader Rumaiz, Robert Kent Bradford, John Thomas Weizeorick, III
  • Publication number: 20190089913
    Abstract: A detecting apparatus includes a multi-tier 3D integrated ASIC comprising one or more analog tiers and one or more digital tiers, and a sensor bonded to the multi-tier 3D integrated ASIC. The detecting apparatus includes an electrical substrate and a group of FPGAs or custom data management ASICs. The detecting apparatus also includes a thermal management system, a power distribution system and one or more connectors to transfer data to a data acquisition system configured for radiation spectroscopy or imaging with zero suppressed or full frame readout.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 21, 2019
    Inventors: Farah Fahim, Grzegorz W. Deptuch, Pawel Grybos, Robert Szczygiel, Piotr Maj, Piotr Kmon, David Peter Siddons, Joseph Mead, Abdul Khader Rumaiz, Robert Kent Bradford, John Thomas Weizeorick, III
  • Patent number: 10075657
    Abstract: A detecting apparatus includes a multi-tier 3D integrated ASIC comprising one or more analog tiers and one or more digital tiers, and a sensor bonded to the multi-tier 3D integrated ASIC. The detecting apparatus includes an electrical substrate and a group of FPGAs or custom data management ASICs. The detecting apparatus also includes a thermal management system, a power distribution system and one or more connectors to transfer data to a data acquisition system configured for radiation spectroscopy or imaging with zero suppressed or full frame readout.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: September 11, 2018
    Assignee: Fermi Research Alliance, LLC
    Inventors: Farah Fahim, Grzegorz W. Deptuch, Pawel Grybos, Robert Szczygiel, Piotr Maj, Piotr Kmon, David Peter Siddons, Joseph Mead, Abdul Khader Rumaiz, Robert Kent Bradford, John Thomas Weizeorick, III
  • Publication number: 20170026598
    Abstract: A detecting apparatus includes a multi-tier 3D integrated ASIC comprising one or more analog tiers and one or more digital tiers, and a sensor bonded to the multi-tier 3D integrated ASIC. The detecting apparatus includes an electrical substrate and a group of FPGAs or custom data management ASICs. The detecting apparatus also includes a thermal management system, a power distribution system and one or more connectors to transfer data to a data acquisition system configured for radiation spectroscopy or imaging with zero suppressed or full frame readout.
    Type: Application
    Filed: July 20, 2016
    Publication date: January 26, 2017
    Inventors: Farah Fahim, Grzegorz W. Deptuch, Pawel Grybos, Robert Szczygiel, Piotr Maj, Piotr Kmon, David Peter Siddons, Joseph Mead, Abdul Khader Rumaiz, Robert Kent Bradford, John Thomas Weizeorick, III