Abstract: An optoelectronic component includes a carrier strip and an optoelectronic semiconductor chip, a first electrical connection surface formed on a front side of the chip and a second electrical connection surface is formed on a rear side of the chip, first and second electrically conductive contact regions are formed on the strip, the first region is arranged on a folding section of the strip, the rear side of the chip faces toward an upper side of the strip, the upper side faces toward the front side of the chip, the first electrical connection surface electrically conductively connects to the first region, the second electrical connection surface electrically conductively connects to the second region by a second connecting material, the strip has a second through-opening that lies next to the second region, and the second connecting material extends through the second contact opening to a lower side of the strip.

Abstract: An optoelectronic component includes a first substrate on which are arranged an active region and a first contact region, and a first contact layer arranged in the first contact region. The second component includes a second substrate on which is arranged at least one second contact layer arranged in a second contact region. The first contact layer connects electrically conductively with the active region and additionally is bonded to the second contact layer by an adhesive layer. The adhesive layer includes an electrically conductive adhesive. The first contact layer and/or the second contact layer are patterned at least in part.

Abstract: An optoelectronic component includes a first substrate on which are arranged an active region and a first contact region, and a first contact layer arranged in the first contact region. The second component includes a second substrate on which is arranged at least one second contact layer arranged in a second contact region. The first contact layer connects electrically conductively with the active region and additionally is bonded to the second contact layer by an adhesive layer. The adhesive layer includes an electrically conductive adhesive. The first contact layer and/or the second contact layer are patterned at least in part.