Patents by Inventor Abdul Mohamed

Abdul Mohamed has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip-Sized Flip-Chip Semiconductor Package and Method for Making the Same
    Publication number: 20070029666
    Abstract: A semiconductor package (10; 14) comprises a semiconductor die (2; 2?) with a plurality of contact areas (4) on its active surface and an electrically conductive bump (7) on each contact area (4). The die (2; 2?) and electrically conductive bumps (7) are encapsulated in a plastic housing (11) so that the plastic housing (11) encapsulates at least sides of the die (2; 2?) and sides of the electrically conductive bumps (7).
    Type: Application
    Filed: July 12, 2006
    Publication date: February 8, 2007
    Inventors: Koh Hoo Goh, Bun-Hin Keong, Abdul Mohamed