Patents by Inventor Abel Chang

Abel Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming overhang support for a stacked semiconductor device
    Patent number: 7588963
    Abstract: A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such that a lateral periphery of an upper die is cantilevered over a lower die thereby forming a recess. A supporting adhesive layer containing a filler is disposed upon the substrate about the lateral periphery of the lower die and substantially filling the recess. In one preferred embodiment, the filler comprises microspheres. In another preferred embodiment, the filler comprises a dummy die, an active die, or a passive die.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: September 15, 2009
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Te-Tsung Chao, Mirng-Ji Lii, Chung-Yi Lin, Abel Chang
  • Overhang support for a stacked semiconductor device, and method of forming thereof
    Publication number: 20060270112
    Abstract: A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such that a lateral periphery of an upper die is cantilevered over a lower die thereby forming a recess. A supporting adhesive layer containing a filler is disposed upon the substrate about the lateral periphery of the lower die and substantially filling the recess. In one preferred embodiment, the filler comprises microspheres. In another preferred embodiment, the filler comprises a dummy die, an active die, or a passive die.
    Type: Application
    Filed: July 28, 2006
    Publication date: November 30, 2006
    Inventors: Te-Tsung Chao, Mirng-Ji Lii, Chung-Yi Lin, Abel Chang
  • Overhang support for a stacked semiconductor device, and method of forming thereof
    Patent number: 7116002
    Abstract: A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such that a lateral periphery of an upper die is cantilevered over a lower die thereby forming a recess. A supporting adhesive layer containing a filler is disposed upon the substrate about the lateral periphery of the lower die and substantially filling the recess. In one preferred embodiment, the filler comprises microspheres. In another preferred embodiment, the filler comprises a dummy die, an active die, or a passive die.
    Type: Grant
    Filed: June 30, 2004
    Date of Patent: October 3, 2006
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Te-Tsung Chao, Mirng-Ji Lii, Chung-Yi Lin, Abel Chang
  • Overhang support for a stacked semiconductor device, and method of forming thereof
    Publication number: 20050248019
    Abstract: A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such that a lateral periphery of an upper die is cantilevered over a lower die thereby forming a recess. A supporting adhesive layer containing a filler is disposed upon the substrate about the lateral periphery of the lower die and substantially filling the recess. In one preferred embodiment, the filler comprises microspheres. In another preferred embodiment, the filler comprises a dummy die, an active die, or a passive die.
    Type: Application
    Filed: June 30, 2004
    Publication date: November 10, 2005
    Inventors: Te-Tsung Chao, Mirng-Ji Lii, Chung-Yi Lin, Abel Chang