Abstract: Aspects of this disclosure relate to a system for energy storage with integrated heating. The system can include a battery cell. The system can include a battery management board assembly coupled to the battery cell. The battery management board assembly can include a printed circuit board, an integrated circuit coupled to the printed circuit board and configured to monitor the battery cell, and an integrated heating element integrated with the printed circuit board and configured to heat the battery cell.

Abstract: A cooling system is disclosed. The cooling system can include a flow path including a main path and a secondary path. The secondary path can have an inlet and an outlet. The inlet can be in fluid communication with a first portion of the main path and the outlet can be in fluid communication with a second portion of the main path. The cooling system can include a passive fluid flow controller. The passive fluid flow controller can be positioned in the main path between the first portion and the second portion. The passive fluid flow controller can adjust an amount of a coolant that is routed to the secondary path from the main path through the inlet of the secondary path. The passive fluid flow controller can impede a particle from entering the secondary path via the inlet of the secondary path.

Abstract: Aspects of this disclosure relate to a method of assembly that includes thermally coupling two components. The method includes providing a thermal interface pad between the two components, such as an integrated circuit and a cooling solution. The thermal interface pad can have a star shape, and a pressure is applied to at least one of the two components. The pressure can cause the star shape thermal interface to expand into a rectangular shape. The expanded rectangular shape does not expand into keep out area positioned around an electronic component of the two components.