Abstract: A medical sensor includes an outer cover that forms a pocket with an opening. The medical sensor also includes one or more electrical components positioned within the outer cover. The medical sensor further includes a biasing member coupled to the outer cover, wherein the biasing member adjusts from an initial shape to an adjusted shape to adjust a dimension of the opening to enable the opening to receive a portion of a patient.

Abstract: A sensor includes a light-emitting diode (LED), a detector to detect light emitted by the LED, and a body that supports the LED and the detector. The body includes a first bandage including a respective surface with a first type of adhesive and a second bandage coupled to a portion of the first bandage and including a respective surface with a second type of adhesive.

Abstract: An oximetry sensor includes a light source configured to emit first light into a tissue of a patient, the first light comprising a first light wavelength greater than a threshold wavelength and a light filter. The light filter is configured to receive the first light from the tissue of the patient, filter a second light wavelength from at least one of the received first light or ambient light. The second light wavelength is less than or equal to the threshold wavelength. The light filter is also configured to output a filtered light that includes the received first light from the tissue. The oximetry sensor also includes a detector configured to detect the filtered light, the filtered light being indicative of an oxygen saturation level of the patient.

Abstract: Non-contact microelectronic device inspection systems and methods are discussed and provided. Some embodiments include a method of generating a virtual reference device (or chip). This approach uses a statistics to find devices in a sample set that are most similar and then averages their time domain signals to generate the virtual reference. Signals associated with the virtual reference can then be correlated with time domain signals obtained from the packages under inspection to obtain a quality signature. Defective and non-defective devices are separated by estimating a beta distribution that fits a quality signature histogram of inspected packages and determining a cutoff threshold for an acceptable quality signature. Other aspects, features, and embodiments are also claimed and described.

Abstract: Non-contact microelectronic device inspection systems and methods are discussed and provided. Some embodiments include a method of generating a virtual reference device (or chip). This approach uses a statistics to find devices in a sample set that are most similar and then averages their time domain signals to generate the virtual reference. Signals associated with the virtual reference can then be correlated with time domain signals obtained from the packages under inspection to obtain a quality signature. Defective and non-defective devices are separated by estimating a beta distribution that fits a quality signature histogram of inspected packages and determining a cutoff threshold for an acceptable quality signature. Other aspects, features, and embodiments are also claimed and described.