Abstract: An armor component including a body having a first portion including calcium boride compounds include non-stoichiometric calcium boride (CaBx) and stoichiometric calcium boride (CaB6) and having a density of at least about 80% theoretical density. In one aspect, the first portion can include a first phase comprising silicon carbide (SiC) and a second phase comprising calcium boride (CaB6). In another aspect, the first portion can further include a third phase comprising boron carbide (B4C).

Abstract: An armor component including a body having a first portion including calcium boride compounds include non-stoichiometric calcium boride (CaBx) and stoichiometric calcium boride (TiO2) and having a density of at least about 80% theoretical density. In one aspect, the first portion can include a first phase comprising silicon carbide (SiC) and a second phase comprising calcium boride (TiO2). In another aspect, the first portion can further include a third phase comprising boron carbide (B4C).

Abstract: An armor component including a body having a first portion including calcium boride compounds include non-stoichiometric calcium boride (CaBx) and stoichiometric calcium boride (CaB6) and having a density of at least about 80% theoretical density. In one aspect, the first portion can include a first phase comprising silicon carbide (SiC) and a second phase comprising calcium boride (CaB6). In another aspect, the first portion can further include a third phase comprising boron carbide (B4C).

Abstract: An armor component including a body having a first portion including calcium boride compounds include non-stoichiometric calcium boride (CaBx) and stoichiometric calcium boride (CaB6) and having a density of at least about 80% theoretical density. In one aspect, the first portion can include a first phase comprising silicon carbide (SiC) and a second phase comprising calcium boride (CaB6). In another aspect, the first portion can further include a third phase comprising boron carbide (B4C).

Abstract: Improved slurry compositions comprising silicon carbide particles and alumina particles dispersed within an aqueous medium. Slurry compositions in the form of abrasive slurry compositions for use chemical mechanical planarization (CMP) processes, particularly abrasive slurry compositions for polishing of sapphire, and methods of use.

Abstract: An armor component including a body including a material component configured to undergo a phase change upon a projectile impact. The material component may also have a ready state defining a first lattice structure configured to change from the ready state to an absorbed state defining a second lattice structure different from the first lattice structure. The material component may also have a ready state defining a first density and configured to change from the ready state to an absorbed state defining a second density, wherein the first density is less than the second density. In a particular aspect, the material component, in combination with a first component on or adjacent to the material component, can be configured to prevent pentration of a projectile having an energy of 4,000 J upon impact with a strikeface of the material component.

Abstract: An armor component including a body including a ceramic component comprising hBN. In one aspect, the hBN is configured to undergo a phase change upon a projectile impact. In another aspect, the ceramic component may also have a ready state defining a hexagonal lattice structure configured to change from the ready state to an absorbed state defining a cubic lattice structure. The ceramic component may also have a ready state defining a first density and configured to change from the ready state to an absorbed state defining a second density, wherein the first density is less than the second density. In a particular aspect, the ceramic component can be configured to prevent penetration of a projectile having an energy of at least 1500 J upon impact with a strikeface of the ceramic component.

Abstract: Improved silicon carbide particles, improved silicon carbide abrasive particles, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes. The particles can comprise nano-sized silicon carbide particles, particularly silicon carbide particles having a surface chemistry similar to silica.

Abstract: Improved slurry compositions comprising a mixture of a first type of particles and a second type of abrasive particles dispersed within an aqueous medium, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes, particularly abrasive slurry compositions for polishing of sapphire. These abrasive slurry compositions comprise a mixture of a first type of abrasive particles having a hardness that is harder than the surface being polished and a second type of abrasive particles have a hardness that is softer than the surface being polished, particularly mixtures of silicon carbide abrasive particles and silica abrasive particles, dispersed within an aqueous medium.

Abstract: Aqueous slurry compositions for use in loose-abrasive machining processes, particularly aqueous abrasive slurries for use in wire saw processes. These aqueous slurry compositions comprise abrasive particles uniformly and stably dispersed in lubricant, which comprises a combination of a vehicle and water, particularly PEG and water.

Abstract: Improved slurry compositions comprising a mixture of a first type of particles and a second type of abrasive particles dispersed within an aqueous medium, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes, particularly abrasive slurry compositions for polishing of sapphire. These abrasive slurry compositions comprise a mixture of a first type of abrasive particles having a hardness that is harder than the surface being polished and a second type of abrasive particles have a hardness that is softer than the surface being polished, particularly mixtures of silicon carbide abrasive particles and silica abrasive particles, dispersed within an aqueous medium.

Abstract: Improved silicon carbide particles, improved silicon carbide abrasive particles, and abrasive slurry compositions for use chemical mechanical planarization (CMP) processes. The particles can comprise nano-sized silicon carbide particles, particularly silicon carbide particles having a surface chemistry similar to silica.

Abstract: Improved slurry compositions comprising silicon carbide particles and alumina particles dispersed within an aqueous medium. Slurry compositions in the form of abrasive slurry compositions for use chemical mechanical planarization (CMP) processes, particularly abrasive slurry compositions for polishing of sapphire, and methods of use.