Patents by Inventor Abhinand RAMAKRISHNAN

Abhinand RAMAKRISHNAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11409935
    Abstract: An integrated circuit structure includes a first metal level comprising a first plurality of interconnect lines along a first direction. A cell is on at least the first metal level, the cell having a pin comprising more than two of the first plurality of interconnect lines. A second metal level comprising a second plurality of interconnect lines overlays the first metal level, where the second plurality of interconnect lines is along a second direction. Two or more vias are on at least one of the second plurality of interconnect lines to connect to the pin.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: August 9, 2022
    Assignee: Intel Corporation
    Inventors: Ranjith Kumar, Srinivasa Chaitanya Gadigatla, Tamanna Husain, Abhinand Ramakrishnan, James Graeber, Kohinoor Basu
  • Publication number: 20200311332
    Abstract: An integrated circuit structure includes a first metal level comprising a first plurality of interconnect lines along a first direction. A cell is on at least the first metal level, the cell having a pin comprising more than two of the first plurality of interconnect lines. A second metal level comprising a second plurality of interconnect lines overlays the first metal level, where the second plurality of interconnect lines is along a second direction. Two or more vias are on at least one of the second plurality of interconnect lines to connect to the pin.
    Type: Application
    Filed: December 27, 2017
    Publication date: October 1, 2020
    Inventors: Ranjith KUMAR, Srinivasa Chaitanya GADIGATLA, Tamanna HUSAIN, Abhinand RAMAKRISHNAN, James GRAEBER, Kohinoor BASU