Patents by Inventor Abhishek Manohar

Abhishek Manohar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240346366
    Abstract: Embodiments of the disclosure provide for intelligent model integration within a process simulation system. Some embodiments receive data associated with the operation of a plant, determine, using at least one specially configured algorithm and based on the received data, at least one qualifying dataset determined qualified to train an intelligent model, train the intelligent model using the at least one qualifying dataset, and deploy the trained intelligent model for use.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Inventors: John Goodman, Kalyanasundaram Palavesh, Mahboubeh Hejazibakhsh, Vijayamahantesh Karpurmath, Abhishek Manohar Pednekar
  • Patent number: 8853080
    Abstract: Methods of producing low resistivity tungsten bulk layers having low roughness and associated apparatus are provided. According to various embodiments, the methods involve CVD deposition of tungsten at high pressures and/or high temperatures. In some embodiments, the CVD deposition occurs in the presence of alternating nitrogen gas pulses, such that alternating portions of the film are deposited by CVD in the absence of nitrogen and in the presence of nitrogen.
    Type: Grant
    Filed: October 2, 2012
    Date of Patent: October 7, 2014
    Assignee: Novellus Systems, Inc.
    Inventors: Yan Guan, Abhishek Manohar, Deqi Wang, Feng Chen, Raashina Humayun
  • Publication number: 20140073135
    Abstract: Methods of producing low resistivity tungsten bulk layers having low roughness and associated apparatus are provided. According to various embodiments, the methods involve CVD deposition of tungsten at high pressures and/or high temperatures. In some embodiments, the CVD deposition occurs in the presence of alternating nitrogen gas pulses, such that alternating portions of the film are deposited by CVD in the absence of nitrogen and in the presence of nitrogen.
    Type: Application
    Filed: October 2, 2012
    Publication date: March 13, 2014
    Inventors: Yan Guan, Abhishek Manohar, Deqi Wang, Feng Chen, Raashina Humayun
  • Publication number: 20140069459
    Abstract: Provided are methods and related apparatus for removing tungsten film from a station of a single-station or multi-station chamber and station component surfaces between tungsten deposition processes. In some embodiments, the methods can involve introducing an inert gas flow upstream of a gas inlet to a station and downstream of a remote plasma generator that provides activated cleaning species. In some embodiments, the methods can involve modulating inert gas flow during various stages of a cleaning process. In some embodiments, the methods can involve manipulating positions of a substrate carrier ring during various stages of the cleaning process. Also in some embodiments, the methods can involve differentially modulating the amounts of inert gas introduced to stations of a multi-station chamber. The methods can provide improved clean uniformity, reduced over-etch, and increased throughput due to shorter cleaning time.
    Type: Application
    Filed: October 17, 2012
    Publication date: March 13, 2014
    Inventors: Yan Guan, Abhishek Manohar, Raashina Humayun, Panya Wongsenakhum
  • Patent number: 8551885
    Abstract: Methods of producing low resistivity tungsten bulk layers having lower roughness and higher reflectivity are provided. The smooth and highly reflective tungsten layers are easier to photopattern than conventional low resistivity tungsten films. The methods involve CVD deposition of tungsten in the presence of alternating nitrogen gas pulses, such that alternating portions of the film are deposited by CVD in the absence of nitrogen and in the presence of nitrogen. According to various embodiments, between 20-90% of the total film thickness is deposited by CVD in the presence of nitrogen.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: October 8, 2013
    Assignee: Novellus Systems, Inc.
    Inventors: Feng Chen, Raashina Humayun, Abhishek Manohar
  • Patent number: 8262800
    Abstract: Improved methods of removing tungsten film from the interior reactor and reactor component surfaces between tungsten deposition operations are provided. The methods involve increasing the availability of molecular fluorine to remove tungsten from the reactor while maintaining fast removal rates. Certain embodiments involve a multi-stage process including a stage in which atomic fluorine is introduced at a low pressure (e.g., about 8 Torr or less) and a stage in which molecular fluorine is introduced or allowed to form in the chamber at high pressure (e.g., about 8 Torr or higher).
    Type: Grant
    Filed: February 12, 2008
    Date of Patent: September 11, 2012
    Assignee: Novellus Systems, Inc.
    Inventors: Panya Wongsenakhum, Abhishek Manohar
  • Publication number: 20100055904
    Abstract: Methods of producing low resistivity tungsten bulk layers having lower roughness and higher reflectivity are provided. The smooth and highly reflective tungsten layers are easier to photopattern than conventional low resistivity tungsten films. The methods involve CVD deposition of tungsten in the presence of alternating nitrogen gas pulses, such that alternating portions of the film are deposited by CVD in the absence of nitrogen and in the presence of nitrogen. According to various embodiments, between 20-90% of the total film thickness is deposited by CVD in the presence of nitrogen.
    Type: Application
    Filed: August 29, 2008
    Publication date: March 4, 2010
    Applicant: Novellus Systems Inc.
    Inventors: Feng CHEN, Raashina Humayun, Abhishek Manohar