Abstract: Electronic device docking station (“docking station”) with cooling system for heat dissipation of docked electronic device, and related methods of docking an electronic device into the docking station. The docking station includes a heat dissipation device in the form of a metal plate that extends from a rear member of the housing of the docking station. The metal plate is configured to be received (either fully or partially) within an internal cavity of an electronic device when the electronic device is disposed on the platform of the housing to be docked in the docking station. In this manner, when the electronic device is disposed on the platform of the docking station housing and docked to the docking station, the metal plate is located in proximity to and thermally coupled to electronic circuits within the electronic device that generate heat. The metal plate dissipates heat generated by the docked electronic device.

Abstract: Heat sink assembly with spring-adjustable heat pipe for improved heat dissipation, and related circuit board assemblies and methods of assembling. The heat sink assembly can be thermally coupled to an electronic device, such as a printed circuit board (PCB) and/or an IC chip(s) mounted on a circuit board to dissipate heat generated from electronic devices. The heat sink assembly includes a heat sink with a spring-adjustable heat pipe between a first electronic device and a heat sink to fill in gap space therebetween and to thermally couple the heat sink to the first electronic device. The spring effect of the spring-adjustable heat pipe provides upward resilient force towards the heat sink when the heat sink is in contact with and applies a downward force onto the spring-adjustable heat pipe to provide a compressed, tight coupling between the heat sink and the spring-adjustable heat pipe for enhanced good thermal coupling.