Abstract: Polymer-ceramic networks in which the polymer chain is anchored in a cera network are formed from compounds of the formula ##STR1## where X is R', OR', OH, H, Cl, or Br,X is R', OR', Cl, or Br,R' is an alkyl group having 1 to 8 carbon atoms, andR is selected from the group consisting of phenyl and a phenyl-substituted benzoxazole group,or oligomers thereof. Methods of forming the monomer, oligomer, and polymer are disclosed. Related phthalocyanine polymers are also disclosed.

Abstract: Polymer-ceramic networks in which the polymer chain is anchored in a cera network are formed from compounds of the formula ##STR1## where X is R', OR', OH, H, Cl, or Br,X is R', OR', Cl, or Br,R' is an alkyl group having 1 to 8 carbon atoms, andR is selected from the group consisting of phenyl and a phenyl-substituted benzoxazole group,or oligomers thereof. Methods of forming the monomer, oligomer, and polymer are disclosed. Related phthalocyanine polymers are also disclosed.

Abstract: Semi-interpenetrating polymer networks having improved processibility and compatibility are prepared by combining a linear polymer comprised of a thermoplastic polyisoimide and a short chain thermosetting polymer in the form of a cross-linkable oligomer comprised of a thermosetting imide or isoimide oligomer containing unsaturated terminal groups, e.g., an acetylene-, a maleimide-, a nadimide- or a benzocyclobutene-terminated imide or isoimide oligomer. In the resulting blend at least one of the diamine and dianhydride moieties of the structural backbone unit of the polyisoimide and of the cross-linkable oligomer are the same, and preferably both of the components of the blend have the same structural backbone unit.

Abstract: Solution blending of (a) a conductive polymer containing carbon-nitrogen linkages, such as polyaniline, having an organic group or an inorganic group, e.g., derived from an anhydride or an aromatic multisulfonic acid, covalently linked to nitrogen atoms of the polymer and (b) a malemide, particularly a bismalemide, e.g., the bismaleimide prepared by reacting 1,3 bis (3 aminophenoxybenzene) with 2 units of maleic anhydride, or a bismaleimide terminated oligomer, in a suitable solvent. On removal of solvent and heating to cure the bismaleimide, a continuous phase blend of the conductive polymer and the bismaleimide is formed, having good electrical conductivity and strength. The solution blend can be applied as a coating on a substrate or can be processed to a powder which can be compressed into parts. The conductive blend can be melted and cured without the evolution of volatiles.

Abstract: Polyimide polymers having a relatively low dielectric constant and good solvent resistance, are formed by polymerization of a polyimide oligomer having the formula ##STR1## wherein R is selected from the group consisting of: --C.tbd.CH,--CH.dbd.CH.sub.2,--CN, and ##STR2## wherein R.sub.1 is --H or --CH.sub.3, and n=1-20. Preferably R is an acetylene group. These polymers may also be formed from the corresponding polyamic acid oligomers.These polymers are useful for forming dielectric layers, particularly in multilayer semiconductor devices.

Abstract: Polymer-ceramic networks in which the polymer chain is anchored in a ceramic network are formed from compounds of the formula ##STR1## where X is R', OR', OH, H, Cl, or Br,X is R', OR', Cl, or Br,R' is an alkyl group having 1 to 8 carbon atoms, andR is selected from the group consisting of phenyl and a phenyl-substituted benzoxazole group,or oligomers thereof. Methods of forming the monomer, oligomer, and polymer are disclosed. Related phthalocyanine polymers are also disclosed.

Abstract: A solar cell having an active surface protected by a free-standing film, said film having the recurring repeating unit: ##STR1## where R is: ##STR2## said film having a molecular weight of at least about 25,000.

Abstract: A solvent polycondensation process of preparing polyimides of high molecular weight from dianhydrides and relatively unreactive diamines, where the reaction is carried out in a cresol as a solvent.

Abstract: A copolymer formed from an isoimide oligomer and another compound, such as an aryl sulfone, each of which has reactive functional terminal groups, such as ethylenic or acetylenic groups. The isoimide oligomer is soluble in the other compound, unreactive with the compound below a certain temperature and forms a liquid blend therewith. Upon heating the liquid blend above that certain temperature, the terminal groups on the isoimide oligomer and the other compound react with each other to form a copolymer. The liquid blends may be used to form encapsulants, coatings, films, and resin matrices for composites to provide resins with excellent high temperature properties.

Abstract: Processes for forming a class of relatively low molecular-weight oligomers containing at least one isoimide group and terminal groups capable of undergoing an addition polymerization reaction are provided. These oligomers are characterized by excellent solubility in common solvents and a melting temperature considerably lower than their cure temperature, thus enabling the oligomers to be formed into cured polymers more slowly and at lower temperatures, all without the evolution of deleterious gases. The process for forming these oligomers includes the formation of a polyamic acid and dehydration thereof under specified conditions to effect cyclization of the polyamic acid to form the isoimide-containing oligomer, without the formation of undesired side-reaction products.

Abstract: A class of relatively low molecular-weight oligomers containing at least one isoimide group and terminal groups capable of undergoing an addition polymerization reaction are provided. These oligomers are characterized by excellent solubility in common solvents and a melting temperature considerably lower than their cure temperature, thus enabling the oligomers to be formed into cured polymers more slowly and at lower temperatures, all without the evolution of deleterious gases. The oligomers of the present invention may be formed by reacting an aromatic dianhydride with an aromatic diamine, followed by reaction with a monoanhydride. The resulting product is dehydrated to form the isoimide-containing oligomer.

Abstract: A class of relatively low molecular-weight oligomers containing at least one isoimide group and terminal groups capable of undergoing an addition polymerization reaction are provided. These oligomers are characterized by excellent solubility in common solvents and a melting temperature considerably lower than their cure temperature, thus enabling the oligomers to be formed into cured polymers more slowly and at lower temperatures, all without the evolution of deleterious gases. The oligomers of the present invention may be formed by reacting an aromatic dianhydride with an aromatic diamine, followed by reaction with a functional mono-amine. The resulting product is then dehydrated to form the isoimide-containing oligomer.

Abstract: A class of relatively low molecular-weight oligomers containing at least one isoimide group and terminal groups capable of undergoing an addition polymerization reaction. The oligomers of the present invention are characterized by excellent solubility in common solvents and a melting temperature considerably lower than their cure temperature, thus enabling the oligomers to be formed into cured polymers more slowly and at lower temperatures, all without the evolution of deletrious gases.

Abstract: Improved diimide and polyimide oligomers containing phenylacetylene terminal groups have been produced which melt at low temperatures and are curable into useful laminating resins, molding compounds and matrix resins. These oligomers are analogous to diimides and polyimides made from conventional dianhydrides, such as benzophenonetetracarboxylic dianhydride or pyromellitic dianhydride.

Abstract: The present invention is directed to a novel class of polynitrile (polycyano) substituted polyimide oligomers and the polyamic acid or ester precursors thereof. The nitrile groups on the oligomers allow the compounds to be cured through addition reactions which result in little or no outgassing. In addition, these oligomers are curable with heat in the presence of catalysts such as those which induce cyano trimerizations. The fully cured polyimides derived from these oligomers have excellent thermal and mechanical properties at high temperatures.

Abstract: The present invention is directed to a novel class of polynitrile (polycyano) substituted polyimide oligomers and the polyamic acid or ester precursors thereof. The nitrile groups on the oligomers allow the compounds to be cured through addition reactions which result in little or no outgassing. In addition, these oligomers are curable with heat in the presence of catalysts such as those which induce cyano trimerizations. The fully cured polyimides derived from these oligomers have excellent thermal and mechanical properties at high temperatures.

Abstract: We have disclosed a new class of thermosetting copolymers derived from terephthalonitrile N,N'-dioxide and polyimide oligomer that cure through addition reactions to form essentially void-free cured resins that exhibit outstanding high temperature stability. These copolymers may be formed from either acetylene terminated polyimide oligomers or nitrile terminated polyimide oligomers. Copolymers prepared in accordance with our invention exhibit little or no outgassing during cure and are extremely useful in the preparation of laminates where high temperature stability and high strength is required.

Abstract: Polyimides are prepared from acetylene substituted polyimide oligomers via an addition polymerization reaction which involves homopolymerization. These polymers exhibit low void content when cured and possess superior thermal stability characteristics and physical properties such as structural strength. One of their unique properties is their ability to be processed into useful articles at moderate pressures and temperatures.