Abstract: A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin.

Abstract: A circuit apparatus of an LED vehicle lamp is disclosed. The circuit apparatus includes an input unit, an LED unit and a current limiting unit. The LED unit includes at least one light-emitting device. Each light-emitting device includes at least one LED and a protection device. The protection device and each one LED are connected in parallel. The circuit apparatus of an LED vehicle lamp protects the element of the LEDs from being damaged, increases traveling safety and simplifies maintenance.

Abstract: A circuit apparatus of an LED vehicle lamp is disclosed. The circuit apparatus includes an input unit, an LED unit and a current limiting unit. The LED unit includes at least one light-emitting device. Each light-emitting device includes at least one LED and a protection device. The protection device and each one LED are connected in parallel. The circuit apparatus of an LED vehicle lamp protects the element of the LEDs from being damaged, increases traveling safety and simplifies maintenance.

Abstract: A structure of light emitted diode package including a lead frame, a holder coupled on an end of the lead frame, a LED chip disposed on the holder, a lower sealing portion made by injection molding a first resin material to grab one end of lead frame with the LED chip in order to hold the lead frame and an upper sealing portion made by casting by a second resin material to dispose on the top of the lower sealing portion.

Abstract: A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin.