Patents by Inventor Achim Froemelt

Achim Froemelt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor module bonding wire connection method
    Patent number: 9925588
    Abstract: A method includes providing a subassembly having a circuit carrier with a first metallic surface portion, a first joining partner, which is integrally connected to the first metallic surface portion by means of a first connecting layer, and a second metallic surface portion. In a heat treatment, the second metallic surface portion is held uninterruptedly at temperatures which are higher than a minimum heat-treatment temperature of at least 300° C. Moreover, a second joining partner is provided. A fixed connection is produced between the second joining partner and the subassembly in that the second joining partner is integrally connected to the subassembly following completion of the heat treatment on the second surface portion.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: March 27, 2018
    Assignee: Infineon Technologies AG
    Inventors: Daniel Bolowski, Achim Froemelt, Christian Kersting, Christian Stahlhut
  • SEMICONDUCTOR MODULE BONDING WIRE CONNECTION METHOD
    Publication number: 20150333034
    Abstract: A method includes providing a subassembly having a circuit carrier with a first metallic surface portion, a first joining partner, which is integrally connected to the first metallic surface portion by means of a first connecting layer, and a second metallic surface portion. In a heat treatment, the second metallic surface portion is held uninterruptedly at temperatures which are higher than a minimum heat-treatment temperature of at least 300° C. Moreover, a second joining partner is provided. A fixed connection is produced between the second joining partner and the subassembly in that the second joining partner is integrally connected to the subassembly following completion of the heat treatment on the second surface portion.
    Type: Application
    Filed: May 11, 2015
    Publication date: November 19, 2015
    Inventors: Daniel Bolowski, Achim Froemelt, Christian Kersting, Christian Stahlhut
  • Soldering method
    Patent number: 8941035
    Abstract: A soldering method is provided. According to the method at least two sets of components are heated and soldered by heating. Each set includes a first soldering partner, a second soldering partner, and a solder. During the soldering process, the individual temperatures of each one of the sets are transmitted by a radio frequency transmitter to a receiving and control unit. The control unit controls the heating of the sets depending on the transmitted individual temperatures.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: January 27, 2015
    Assignee: Infineon Technologies AG
    Inventors: Guido Strotmann, Achim Froemelt
  • Soldering Method
    Publication number: 20120248094
    Abstract: A soldering method is provided. According to the method at least two sets of components are heated and soldered by heating. Each set includes a first soldering partner, a second soldering partner, and a solder. During the soldering process, the individual temperatures of each one of the sets are transmitted by a radio frequency transmitter to a receiving and control unit. The control unit controls the heating of the sets depending on the transmitted individual temperatures.
    Type: Application
    Filed: March 31, 2011
    Publication date: October 4, 2012
    Applicant: Infineon Technologies AG
    Inventors: Guido Strotmann, Achim Froemelt