Abstract: A method for producing a microelectromechanical sensor. The microelectromechanical sensor is produced by connecting a cap wafer to a sensor wafer. The cap wafer has a bonding structure for connecting the cap wafer to the sensor wafer. The sensor wafer has a sensor core having a movable structure. The cap wafer has a stop structure for limiting an excursion of the movable structure. The method includes a first step and a second step following the first step, the stop surface of the stop structure being situated at the level of the original surface of the unprocessed cap wafer.

Abstract: A method for producing a microelectromechanical sensor. The microelectromechanical sensor is produced by connecting a cap wafer to a sensor wafer. The cap wafer has a bonding structure for connecting the cap wafer to the sensor wafer. The sensor wafer has a sensor core having a movable structure. The cap wafer has a stop structure for limiting an excursion of the movable structure. The method includes a first step and a second step following the first step, the stop surface of the stop structure being situated at the level of the original surface of the unprocessed cap wafer.

Abstract: A method for setting a pressure in a cavity formed with the aid of a substrate and a substrate cap, a microelectromechanical system being situated in the cavity, the substrate including a main extension plane. The method includes the following steps: in a first step a clearance is created in the substrate cap, the clearance connecting the cavity to the surroundings, a first clearance end of the clearance being formed on a first surface of the substrate cap that faces away from the cavity, a second clearance end of the clearance being formed on a cavity-side second surface of the substrate cap, the first clearance end and the second clearance end being situated at a distance from one another at least in a first direction which is parallel to the main extension plane; in a second step, after the first step, the clearance is sealed.

Abstract: A method for setting a pressure in a cavity formed with the aid of a substrate and a substrate cap, a microelectromechanical system being situated in the cavity, the substrate including a main extension plane. The method includes the following steps: in a first step a clearance is created in the substrate cap, the clearance connecting the cavity to the surroundings, a first clearance end of the clearance being formed on a first surface of the substrate cap that faces away from the cavity, a second clearance end of the clearance being formed on a cavity-side second surface of the substrate cap, the first clearance end and the second clearance end being situated at a distance from one another at least in a first direction which is parallel to the main extension plane; in a second step, after the first step, the clearance is sealed.