Patents by Inventor Ackerman C. John

Ackerman C. John has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of forming semiconductor structure
    Patent number: 6436793
    Abstract: A method of forming a semiconductor structure from a first wafer and a second wafer. A pit or groove is formed in a lower surface of the first wafer. The lower surface of the first wafer is bonded to an upper surface of the second wafer. A groove is then formed on an upper surface of the first wafer, such that an opening is formed in the first wafer that exposes at least one alignment reference target on the upper surface of the second wafer. The bonded first wafer and second wafer is then diced using the exposed at least one alignment reference target to form a semiconductor structure.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: August 20, 2002
    Assignee: Xerox Corporation
    Inventors: Gary A. Kneezel, Daniel E. Kuhman, Brian T. Ormond, Ackerman C. John, Almon P. Fisher, Allan F. Camp, Lawrence H. Herko