Patents by Inventor Ada Shen

Ada Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package having thermally conductive layers for heat dissipation
    Patent number: 11488883
    Abstract: A semiconductor device package includes a substrate, a heat-generating component positioned on a surface of the substrate, and an encapsulant at least partially covering the heat-generating component and having an outer surface. A first heat-conducting layer is disposed between the encapsulant and the first heat-generating component. One or more pillars are in contact with the first heat-conducting layer and extend to the outer surface of the encapsulant and contact a second heat-conducting layer disposed on the outer surface of the encapsulant.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: November 1, 2022
    Assignee: Western Digital Technologies, Inc.
    Inventors: Yazhou Zhang, Jiandi Du, Hope Chiu, Cong Zhang, Fen Yu, Ada Shen, Gary Zheng, Honny Chen
  • SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE LAYERS FOR HEAT DISSIPATION
    Publication number: 20220328374
    Abstract: A semiconductor device package includes a substrate, a heat-generating component positioned on a surface of the substrate, and an encapsulant at least partially covering the heat-generating component and having an outer surface. A first heat-conducting layer is disposed between the encapsulant and the first heat-generating component. One or more pillars are in contact with the first heat-conducting layer and extend to the outer surface of the encapsulant and contact a second heat-conducting layer disposed on the outer surface of the encapsulant.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 13, 2022
    Applicant: Western Digital Technologies, Inc.
    Inventors: Yazhou Zhang, Jiandi Du, Hope Chiu, Cong Zhang, Fen Yu, Ada Shen, Gary Zheng, Honny Chen