Patents by Inventor Adam BEECE

Adam BEECE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC CIRCUIT ASSEMBLY SUBSTRATE AND DEVICE THEREOF
    Publication number: 20160165729
    Abstract: A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.
    Type: Application
    Filed: February 18, 2016
    Publication date: June 9, 2016
    Inventors: Saket CHADDA, Ramakanth ALAPATI, Adam BEECE
  • Method for electronic circuit assembly on a paper substrate
    Patent number: 9318466
    Abstract: A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.
    Type: Grant
    Filed: August 28, 2014
    Date of Patent: April 19, 2016
    Assignee: GlobalFoundries Inc.
    Inventors: Saket Chadda, Ramakanth Alapati, Adam Beece
  • METHOD FOR ELECTRONIC CIRCUIT ASSEMBLY ON A PAPER SUBSTRATE
    Publication number: 20160064354
    Abstract: A methodology for a thin, flexible substrate having integrated passive circuit elements, and the resulting device are disclosed. Embodiments may include integrating one or more passive circuit components on a first or second surface of a substrate, and interconnecting one or more integrated circuit (IC) dies on a second surface of the interposer to the one or more passive circuit components with one or more metal-filled vias between the first and second surfaces, the first and second surfaces being opposite surfaces of the substrate.
    Type: Application
    Filed: August 28, 2014
    Publication date: March 3, 2016
    Inventors: Saket CHADDA, Ramakanth ALAPATI, Adam BEECE