Abstract: Embodiments include a system and circuit for measuring characteristics of a material under test (MUT). In some cases, the system includes a circuit having level detectors to measure the change in strength between a reference signal and a return signal passed through the MUT. The system can include a computing device to evaluate the measured signals and adjust those signals within range of the level detectors and other circuit components. Circuits can include a time-of-flight digital convertor for determining the phase shift between the reference and return signals that pass through the MUT. The measured difference in signal strength and phase can be used to compute the complex impedance or dielectric properties of the MUT. This impedance or dielectric property can be correlated with a physical property of the MUT. The system may be operated at a single frequency, or over a range of frequencies.

Abstract: Embodiments include a system and circuit for measuring characteristics of a material under test (MUT). In some cases, the system includes a circuit having level detectors to measure the change in strength between a reference signal and a return signal passed through the MUT. The system can include a computing device to evaluate the measured signals and adjust those signals within range of the level detectors and other circuit components. Circuits can include a time-of-flight digital convertor for determining the phase shift between the reference and return signals that pass through the MUT. The measured difference in signal strength and phase can be used to compute the complex impedance or dielectric properties of the MUT. This impedance or dielectric property can be correlated with a physical property of the MUT. The system may be operated at a single frequency, or over a range of frequencies.

Abstract: A testing apparatus measures cooling power of an electrically-powered Microclimate Cooling Unit (MCU) at the point of use of the MCU. The tester includes fluid supply and return ports for fluidly connecting to the MCU. A fluid heater provides a heat load to fluid in the tester. Fluid temperatures upstream and downstream of the heater are measured. The fluid flow rate is adjustable and measurable. A digital processor extracts the temperature and fluid flow rate data and computes cooling watts. The computed cooling watts are compared to the manufacturer's specifications to determine if the MCU is operating properly.

Abstract: A sliding breechblock for a cannon includes a translatable, removable insert assembly that contains electrical firing pin and data link modules. The removable insert assembly is translatable in a direction normal to the central longitudinal axis of the barrel thereby enabling removal of the insert assembly without removing the breechblock from the breech ring. Mating portions formed on the breechblock and on the insert assembly prevent displacement of the insert assembly with respect to the breechblock in the direction along the central longitudinal axis of the barrel.

Abstract: A breech mechanism sliding contact assembly that allows for ignition, gun ground, and ammunition data link circuits to be broken while the breechblock is open. The sliding contact assembly further allows these circuits to be reconnected when the breechblock is closed. The breech mechanism sliding contact assembly comprises two separate connectors: a block slide connector that assembles to the breechblock and a ring slide connector that assembles to the breech ring. The two connectors operate in compact, pre-existing headspaces between the breechblock and the breech ring.