Abstract: An electrochemical cell includes an electrolyte layer, an anode electrode disposed over a first surface of the electrolyte layer, a ceramic anode support laterally surrounding the anode electrode and embedded in the anode electrode, such that a recess configured to receive a seal is located above a periphery of the ceramic anode support, and a cathode disposed over a second surface of the electrolyte layer.

Abstract: A method of forming a protective layer on an interconnect for an electrochemical cell stack includes coating at least one side of the interconnect with a metal oxide powder to form a protective layer, sintering the coated interconnect in an inert atmosphere to at least partially reduce the protective layer, and oxidizing the sintered interconnect in an oxidizing atmosphere to oxidize and densify the protective layer.

Abstract: A method includes binder jet printing a metal alloy powder or a metal powder mixture to form a green interconnect, debinding the green interconnect, and sintering the green interconnect to form a metal alloy interconnect for an electrochemical stack.

Abstract: A method of forming a protective coating on an interconnect for an electrochemical device stack includes providing a powder on the interconnect and laser sintering the powder.

Abstract: A method of forming an interconnect for an electrochemical device stack includes loading a die with an interconnect material comprising an interconnect body powder comprising chromium and iron, and spark plasma sintering (SPS) the interconnect material to form a body of the interconnect.