Patents by Inventor Adam C. Gropp

Adam C. Gropp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10645840
    Abstract: A heatsink for heat dissipation amongst an active electronically steered array (AESA) on a printed circuit board (PCB) includes a metal plate having a first side and a second side; a plurality of integrally formed pockets on the first side of the metal plate each being sized and configured for congruent receipt of a corresponding one of a plurality of functional blocks of the AESA on the PCB; a plurality of waveguide manifolds on the second side of the metal plate including a plurality of holes that launch a wave transmission and a plurality of slots that guide the direction of the wave transmission; and wherein the metal plate prevents localized overheating amongst the AESA by positioning the metal plate on the PCB wherein the plurality of integrally formed pockets and the plurality of holes and the plurality of slots of the plurality of waveguide manifolds facilitate heat dissipation.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: May 5, 2020
    Assignee: AvL Technologies, Inc.
    Inventors: Ian J. Timmins, Wayne Holt, Alan Ellis, Adam C. Gropp, Keith Edenfield, Bruce Barratt