Patents by Inventor Adam C. Smith
Adam C. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240086624Abstract: A digital display of an active window is provided. An application, separate from the application providing the digital display, is capable of identifying an artifact in the active window of the digital display without a priori knowledge or an application programming interface to the application providing the digital display. The artifacts may be alpha-numeric artifacts or non-alpha-numeric artifacts. The active window may be examined in multiple dimensions including 2 dimensions, 3 dimensions or more. Alpha-numeric artifacts, once identified, are pre-processed to remove anti-aliasing to allow for processor optical recognition.Type: ApplicationFiled: November 14, 2023Publication date: March 14, 2024Inventors: Charles N. Corfield, Stephen L. Bulick, E. Peter Fox, Adam M. Ornstein, Derek C. Smith
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Patent number: 10700013Abstract: Aspects of the present disclosure provide an integrated circuit (IC) wafer having a plurality of circuit dies each bounded by a set of scribe lines. The IC structure includes: a plurality of reference features each respectively positioned in a first layer of one of the plurality of circuit dies. The reference feature of each circuit die is equidistant from a respective set of scribe lines for the circuit die, and a plurality of identification features each positioned in a second layer of one of the plurality of circuit dies. The reference feature of each circuit die has a distinct offset vector indicative of a positional difference between the identification feature for the circuit die and the reference feature for the circuit die, relative to the identification feature of each other circuit die.Type: GrantFiled: January 10, 2018Date of Patent: June 30, 2020Assignee: GLOBALFOUNDRIES INC.Inventors: Wen Liu, Sebastian T. Ventrone, Adam C. Smith, Janice M. Adams, Nazmul Habib
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Publication number: 20190214348Abstract: Aspects of the present disclosure provide an integrated circuit (IC) wafer having a plurality of circuit dies each bounded by a set of scribe lines. The IC structure includes: a plurality of reference features each respectively positioned in a first layer of one of the plurality of circuit dies. The reference feature of each circuit die is equidistant from a respective set of scribe lines for the circuit die, and a plurality of identification features each positioned in a second layer of one of the plurality of circuit dies. The reference feature of each circuit die has a distinct offset vector indicative of a positional difference between the identification feature for the circuit die and the reference feature for the circuit die, relative to the identification feature of each other circuit die.Type: ApplicationFiled: January 10, 2018Publication date: July 11, 2019Inventors: Wen Liu, Sebastian T. Ventrone, Adam C. Smith, Janice M. Adams, Nazmul Habib
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Patent number: 9927698Abstract: A method and system for: forming a first rectangular shape with photomask writing equipment, using a first sub-threshold dosage on a photoresist layer of a photomask substrate; forming an overlapping second rectangular shape with the photomask writing equipment using a second sub-threshold dosage on the photoresist layer, the second rectangular shape being rotated relative to the first rectangular shape to form one of: a hexagonal overlap area and an octagonal overlap area, that exposes the photoresist layer to at least a threshold dosage; and forming a photomask, based on developing the exposed photoresist layer, to provide optical transmission corresponding to the one of: the hexagonal overlap area of at least the threshold dosage and the octagonal overlap area of at least the threshold dosage, for use by a photolithography system to write any of a contact, a via, or a curvilinear shape on an integrated circuit substrate.Type: GrantFiled: August 11, 2016Date of Patent: March 27, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: Jed H. Rankin, Adam C. Smith
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Publication number: 20180046073Abstract: A method and system for: forming a first rectangular shape with photomask writing equipment, using a first sub-threshold dosage on a photoresist layer of a photomask substrate; forming an overlapping second rectangular shape with the photomask writing equipment using a second sub-threshold dosage on the photoresist layer, the second rectangular shape being rotated relative to the first rectangular shape to form one of: a hexagonal overlap area and an octagonal overlap area, that exposes the photoresist layer to at least a threshold dosage; and forming a photomask, based on developing the exposed photoresist layer, to provide optical transmission corresponding to the one of: the hexagonal overlap area of at least the threshold dosage and the octagonal overlap area of at least the threshold dosage, for use by a photolithography system to write any of a contact, a via, or a curvilinear shape on an integrated circuit substrate.Type: ApplicationFiled: August 11, 2016Publication date: February 15, 2018Applicant: GLOBALFOUNDRIES INC.Inventors: JED H. RANKIN, ADAM C. SMITH
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Patent number: 8518611Abstract: A mask fabrication method can include receiving a mask design, sending first exposure parameters to a first exposure machine, sending second exposure parameters to a second exposure machine, sending a first exposure generation command to the first machine based on the first exposure parameters and sending a second exposure generation command to the second machine based on the second exposure parameters.Type: GrantFiled: January 14, 2011Date of Patent: August 27, 2013Assignee: International Business Machines CorporationInventors: Brent A. Anderson, Jeb H. Rankin, Adam C. Smith
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Publication number: 20120183889Abstract: A mask fabrication method can include receiving a mask design, sending first exposure parameters to a first exposure machine, sending second exposure parameters to a second exposure machine, sending a first exposure generation command to the first machine based on the first exposure parameters and sending a second exposure generation command to the second machine based on the second exposure parameters.Type: ApplicationFiled: January 14, 2011Publication date: July 19, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brent A. Anderson, Jed H. Rankin, Adam C. Smith
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Patent number: 7960288Abstract: A photoresist trimming gas compound is provided which will selectively remove a resist foot or scum from the lower portions of sidewalls of a photoresist. Additionally, the trimmer compound hardens or toughens an upper surface of the photoresist thereby strengthening the photoresist. The trimmer compound includes O2 and at least one other gaseous oxide and is typically utilized in a dry etching process after a trench has been formed in a photoresist. The other oxide gases, in addition to the O2 may include CO2, SO2 and NO2.Type: GrantFiled: October 9, 2007Date of Patent: June 14, 2011Assignee: International Business Machines CorporationInventors: Shaun Crawford, Cuc K. Huynh, A. Gary Reid, Adam C. Smith, Thomas M. Wagner
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Patent number: 7955988Abstract: A photoresist trimming gas compound is provided which will selectively remove a resist foot or scum from the lower portions of sidewalls of a photoresist. Additionally, the trimmer compound hardens or toughens an upper surface of the photoresist thereby strengthening the photoresist. The trimmer compound includes O2 and at least one other gaseous oxide and is typically utilized in a dry etching process after a trench has been formed in a photoresist. The other oxide gases, in addition to the O2 may include CO2, SO2 and NO2.Type: GrantFiled: September 27, 2007Date of Patent: June 7, 2011Assignee: International Business Machines CorporationInventors: Shaun Crawford, Cuc K. Huynh, A. Gary Reid, Adam C. Smith, Thomas M. Wagner
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Patent number: 7304000Abstract: A photoresist trimming gas compound is provided which will selectively remove a resist foot or scum from the lower portions of sidewalls of a photoresist. Additionally, the trimmer compound hardens or toughens an upper surface of the photoresist thereby strengthening the photoresist. The trimmer compound includes O2 and at least one other gaseous oxide and is typically utilized in a dry etching process after a trench has been formed in a photoresist The other oxide gases, in addition to the O2 may include CO2, SO2 and NO2.Type: GrantFiled: August 19, 2004Date of Patent: December 4, 2007Assignee: International Business Machines CorporationInventors: Shaun Crawford, Cuc K. Huynh, A. Gary Reid, Adam C. Smith, Thomas M. Wagner
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Patent number: 6676116Abstract: A vibration isolator is provided that includes a plurality of elastomeric members. The vibration isolator also includes first and second supports. The first and second supports cooperate with the plurality of elastomeric members to isolate and damp vibration between the first and second supports. The first support defines a first raised portion. The second support is spaced from the first support and defines a second raised portion facing the first support. The first and second raised portions are structured to cooperate so as to define a recess therebetween adapted to at least partially receive at least one elastomeric member. The vibration isolator also includes at least one fastener that is structured to mount the at least one elastomeric member between the first and second supports such that the elastomeric member(s) isolates and damps vibration transmitted between the first and second supports.Type: GrantFiled: July 5, 2001Date of Patent: January 13, 2004Assignee: The Boeing CompanyInventors: Donald L. Edberg, Adam C. Smith, Michael L. Hand, Jonathan E. Bosley
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Publication number: 20030183995Abstract: A vibration isolator is provided that includes a plurality of elastomeric members. The vibration isolator also includes first and second supports. The first and second supports cooperate with the plurality of elastomeric members to isolate and damp vibration between the first and second supports. The first support defines a first raised portion. The second support is spaced from the first support and defines a second raised portion facing the first support. The first and second raised portions are structured to cooperate so as to define a recess therebetween adapted to at least partially receive at least one elastomeric member. The vibration isolator also includes at least one fastener that is structured to mount the at least one elastomeric member between the first and second supports such that the elastomeric member(s) isolates and damps vibration transmitted between the first and second supports.Type: ApplicationFiled: July 5, 2001Publication date: October 2, 2003Applicant: The Boeing CompanyInventors: Donald L. Edberg, Adam C. Smith, Michael L. Hand, Jonathan E. Bosley