Abstract: A phase-change oscillator and pulse generator, and related methods, are provided. The phase-change oscillator and pulse generator can include a capacitor, a switching element coupled in parallel connection with the capacitor, and a resistor coupled in series with the switching element and configured to supply a bias voltage to the switching element. The switching element can have a low-resistance state in a liquid-phase and a high-resistance state in a solid phase. In addition, the switching element can have a negative thermal coefficient of resistance. In an aspect, the switching element comprises a wire of a semiconducting material having negative thermal coefficient of resistance, such semiconducting material can be doped n-type or p-type. In an aspect, the liquid-phase is a molten state of the wire and the solid-phase is a solid state of the wire. An oscillatory signal is based at least on transitioning between the molten state and the solid state.

Abstract: The method for forming circuitization of the present invention provides a circuitized product which does not have a blanket seed layer and only has seed layer under the metal circuitization. Thus, short circuits between circuit lines are eliminated. It is a further advantage of the method of the present invention that it does not involve stripping portions of the seed layer. The method of the present invention requires less processing steps than conventional methods and employs positive resists which are developable by aqueous alkaline solutions.

Abstract: The present invention provides a method of ablative photodecomposition and forming metal pattern which attains high resolution, is convenient, and employs non-halogenated solvents. The present invention is directed to a process for forming a metal pattern, preferably circuitization on an organic substrate, preferably on a circuit board or component thereof, which comprises coating the substrate with an ablatively-removable coating comprising a polymer resin preferably an acrylate polymer resin and preferably an ultraviolet absorber. A pattern is formed in the polymer coating corresponding to the desired metal pattern by irradiating at least a portion of the polymer coating with a sufficient amount of ultraviolet radiation to thereby ablatively remove the irradiated portion of the polymer coating. Next the patterned substrate is coated with a conductive metal paste to define the metal pattern, and the conductive metal paste is cured.