Patents by Inventor Adam D. Leeds

Adam D. Leeds has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190315501
    Abstract: An apparatus includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes a lid and a body. The structure also includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more oscillating heat pipes embedded in at least some of the thermomechanical regions. Different portions of at least one of the lid and the body form the thermomechanical regions. The one or more oscillating heat pipes are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change. Each of the one or more oscillating heat pipes includes at least one channel in the structure.
    Type: Application
    Filed: April 17, 2019
    Publication date: October 17, 2019
    Inventors: Tuan L. Duong, Adam D. Leeds, James E. Benedict, Joseph A. Boswell, Daniel A. Pounds
  • Publication number: 20190315500
    Abstract: A system includes a flight vehicle and one or more deployable radiators. Each deployable radiator includes a structure configured to receive thermal energy and to reject the thermal energy into an external environment. The structure includes (i) multiple inline and interconnected thermomechanical regions and (ii) one or more thermal energy transfer devices embedded in at least some of the thermomechanical regions. The one or more thermal energy transfer devices are configured to transfer the thermal energy between different ones of the thermomechanical regions. At least one of the thermomechanical regions includes one or more shape-memory materials configured to cause a shape of the structure to change.
    Type: Application
    Filed: April 16, 2019
    Publication date: October 17, 2019
    Inventors: Tuan L. Duong, Adam D. Leeds, James E. Benedict