Patents by Inventor Adam D. Wachsman

Adam D. Wachsman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250062379
    Abstract: The present invention relates to a doped cubic bismuth oxide that is phase stable in a temperature range of from about 550° C. to about 700° C. The doped cubic bismuth oxide comprises a mixture of a first dopant and a second dopant.
    Type: Application
    Filed: November 4, 2024
    Publication date: February 20, 2025
    Applicant: University of Maryland, College Park
    Inventors: Eric D. Wachsman, Adam Jolley
  • Publication number: 20250055009
    Abstract: The present invention relates to rhomboidal phase bismuth oxide that maintains electric conductivity of at least about 1×10?2 S/cm at temperature of about 500° C. for at least about 100 hours. In particular, the bismuth oxides of the invention have stable conductivity at a temperature range from about 500° C. to about 550° C.
    Type: Application
    Filed: April 1, 2024
    Publication date: February 13, 2025
    Applicant: University of Maryland, College Park
    Inventors: Eric D. Wachsman, Adam Jolley
  • Patent number: 7483271
    Abstract: A two-part, high-density card retention system includes a tapered channel in a chassis or housing and a mating wedge that runs the length of the housing, with the lead wedge being cammed towards a flat channel surface by drawing the wedge inwardly and locating the edge of the board to be mounted between the wedge and the opposing straight channel wall. The mounting provides continuous high-pressure contact between the board and the straight channel wall for maximal thermal transfer and robust anti-vibration and anti-shock mounting of the board to the chassis. Because no additional assemblies are mounted to the edge of the board, the boards may be spaced apart by a fine pitch, thus to minimize the size of the module into which the boards are mounted.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: January 27, 2009
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Richard D. Miller, Adam D. Wachsman