Abstract: A method of using ultrasound waves that are focused at a specific location in a medium is provided to cause localized production of bubbles at that location and to control the production, and the cavitational and heating effects that take place there. Production and control are accomplished by interference-specific waveforms at the focal point, which are not produced at other locations. Preferably, the region within the focal zone of all the transducers in which the specific waveform develops at significant intensities are very small. The method, and a system that performs the method, can be used to perform a variety of therapeutic procedures. Typical of such procedures is occlusion of varicose veins.

Abstract: The invention is a method of using ultrasound waves that are focused at a specific location in a medium to cause localized production of bubbles at that location and to control the production, and the cavitational and heating effects that take place there. According to the method of the invention, the production and control is accomplished by selecting the range of parameters of multiple transducers that are focused at the location such that they produce by interference specific waveforms at the focal point, which are not produced at other locations. Preferably the region within the focal zone of all the transducers in which the specific waveform develops at significant intensities, is typically very small. The invention is also a system for carrying out the method. The method and system of the invention can be used to perform a variety of therapeutic procedures. Typical of such procedures is occlusion of varicose veins.

Abstract: A device and method for preventing settlement of particles on a chemical-mechanical polishing pad is provided. Specifically, a device capable of preventing settlement of particles on the pad is located between the polishing pad and a platen of a chemical-mechanical polishing apparatus.

Abstract: A vertically-oriented wafer polishing apparatus and method is disclosed including a vertically-oriented polishing device, a semiconductor wafer carrier and a cleaning module to clean the polishing device by removing contaminants that may scratch the wafer and also reduce the polishing rate of the apparatus. The device reduces the "down time" of a polishing apparatus and, therefore, increases the yield of well-polished wafers in a given time period.