Patents by Inventor Adam Delaney Boyd

Adam Delaney Boyd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device enclosure temperature control
    Patent number: 12066846
    Abstract: Current temperatures for an enclosure of a media handling device are monitored and managed using threshold temperature values. When a current temperature deviates below a threshold temperature value, commands are sent to modules of the device to start and idle their motors causing heat to be generated from current flowing to the motors. The heat radiates within the enclosure raising the current temperature. When the current temperature reaches a second threshold temperature value for the enclosure, second commands are sent to the modules of the device to stop idling their motors causing heat within the enclosure to dissipate and lowering the current temperature for the enclosure.
    Type: Grant
    Filed: September 29, 2022
    Date of Patent: August 20, 2024
    Assignee: NCR Atleos Corporation
    Inventors: Paul David Rutherford, Adam Delaney Boyd, Donald Iain MacInnes, He Ren
  • DEVICE ENCLOSURE TEMPERATURE CONTROL
    Publication number: 20240111318
    Abstract: Current temperatures for an enclosure of a media handling device are monitored and managed using threshold temperature values. When a current temperature deviates below a threshold temperature value, commands are sent to modules of the device to start and idle their motors causing heat to be generated from current flowing to the motors. The heat radiates within the enclosure raising the current temperature. When the current temperature reaches a second threshold temperature value for the enclosure, second commands are sent to the modules of the device to stop idling their motors causing heat within the enclosure to dissipate and lowering the current temperature for the enclosure.
    Type: Application
    Filed: September 29, 2022
    Publication date: April 4, 2024
    Inventors: Paul David Rutherford, Adam Delaney Boyd, Donald Iain MacInnes, He Ren