Patents by Inventor Adam Hardman

Adam Hardman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10738928
    Abstract: According to one aspect, a manifold assembly includes a skid, a low pressure manifold connected to the skid, and a high pressure manifold connected to the skid. In another aspect, the high pressure manifold has a modular configuration so that the high pressure manifold is disconnectable in whole or in part from the skid, and reconnectable in whole or in part to the skid. In yet another aspect, the high pressure manifold includes high pressure modules, all of which are in fluid communication with each other and each of which is adapted to be in fluid communication with at least one pump. In still yet another aspect, the low pressure manifold includes one or more flow lines, the high pressure manifold includes fittings, and the manifold assembly includes vibration isolators to dampen dynamic loading, the vibration isolators being disposed between the fittings and the one or more flow lines.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: August 11, 2020
    Assignee: S.P.M. Flow Control, Inc.
    Inventors: Ron Arizpe, Lun Tsuei, Timothy Long, Adam Hardman, Matthew Green
  • Publication number: 20170130885
    Abstract: According to one aspect, a manifold assembly includes a skid, a low pressure manifold connected to the skid, and a high pressure manifold connected to the skid. In another aspect, the high pressure manifold has a modular configuration so that the high pressure manifold is disconnectable in whole or in part from the skid, and reconnectable in whole or in part to the skid. In yet another aspect, the high pressure manifold includes high pressure modules, all of which are in fluid communication with each other and each of which is adapted to be in fluid communication with at least one pump. In still yet another aspect, the low pressure manifold includes one or more flow lines, the high pressure manifold includes fittings, and the manifold assembly includes vibration isolators to dampen dynamic loading, the vibration isolators being disposed between the fittings and the one or more flow lines.
    Type: Application
    Filed: January 20, 2017
    Publication date: May 11, 2017
    Inventors: Ron Arizpe, Lun Tsuei, Timothy Long, Adam Hardman, Matthew Green
  • Patent number: 9568138
    Abstract: According to one aspect, a manifold assembly includes a skid, a low pressure manifold connected to the skid, and a high pressure manifold connected to the skid. In another aspect, the high pressure manifold has a modular configuration so that the high pressure manifold is disconnectable in whole or in part from the skid, and reconnectable in whole or in part to the skid. In yet another aspect, the high pressure manifold includes high pressure modules, all of which are in fluid communication with each other and each of which is adapted to be in fluid communication with at least one pump. In still yet another aspect, the low pressure manifold includes one or more flow lines, the high pressure manifold includes fittings, and the manifold assembly includes vibration isolators to dampen dynamic loading, the vibration isolators being disposed between the fittings and the one or more flow lines.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: February 14, 2017
    Assignee: S.P.M. FLOW CONTROL, INC.
    Inventors: Ron Arizpe, Lun Tsuei, Timothy Long, Adam Hardman, Matthew Green
  • Publication number: 20150000766
    Abstract: According to one aspect, a manifold assembly includes a skid, a low pressure manifold connected to the skid, and a high pressure manifold connected to the skid. In another aspect, the high pressure manifold has a modular configuration so that the high pressure manifold is disconnectable in whole or in part from the skid, and reconnectable in whole or in part to the skid. In yet another aspect, the high pressure manifold includes high pressure modules, all of which are in fluid communication with each other and each of which is adapted to be in fluid communication with at least one pump. In still yet another aspect, the low pressure manifold includes one or more flow lines, the high pressure manifold includes fittings, and the manifold assembly includes vibration isolators to dampen dynamic loading, the vibration isolators being disposed between the fittings and the one or more flow lines.
    Type: Application
    Filed: June 30, 2014
    Publication date: January 1, 2015
    Inventors: Ron Arizpe, Lun Tsuei, Timothy Long, Adam Hardman, Matthew Green
  • Patent number: D873860
    Type: Grant
    Filed: July 15, 2016
    Date of Patent: January 28, 2020
    Assignee: S.P.M. Flow Control, Inc.
    Inventors: Ron Arizpe, Adam Hardman, Peter Walter